COMPONENT PACKAGES

TO-277A (SMPC) Component Package

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Contents

Overview

Name (JEDEC)TO-277A (Transistor Outline 277A)
SynonymsSMPC (Vishay)
Variantsn/a
Similar Ton/a
MountingSMD
Pin Count3 (2 pins + 1 pad)
Pitch

2.13mm (between pins 1 and 2, excluding the pad (pin 3))

SolderabilityA little tricky to solder by hand, as this package has a pad. However, since the pad comes right to the edge, it can be done with a large and hot enough soldering iron tip. Easy to solder with with infrared or reflow techniques.
Thermal Resistance
  • \(T_{JC} = 3^{\circ}{\rm C}/W\)
  • \(T_{JA} = 60^{\circ}{\rm C}/W\) (recommended land pattern, no thermal vias)
Physical Dimensions
  • Package Size: 4.60x6.50x1.10mm (widthlengthheight)
  • Recommended Footprint Land Area: 4.8x6.8mm = 32.6mm2
3D Models
Common UsesMedium/high power diodes.

Comments

Used by Vishay and Bruckewell.

3D Renders

A 3D render of the TO-277A component package.

A 3D render of the TO-277A component package.

Dimensions

Dimensions and land pattern for the TO-277A (SMPC) component package.

Dimensions and land pattern for the TO-277A (SMPC) component package.

Authors

Geoffrey Hunter

Dude making stuff.

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License .

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