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MLP Component Package

Authors:
Geoffrey Hunter
Geoffrey Hunter
Published On:
Mar 9, 2022
Last Updated:
Mar 9, 2022

The MLP (Molded Leadless Package) component package is a synonym for the QFN package used by Fairchild Semiconductor1.

Footnotes

  1. Fairchild Semiconductor (2005, Sep). PCB Land Pattern Design and Surface Mount Guidelines for MLP Packages. Retrieved 2022-03-09, from http://educypedia.karadimov.info/library/AN-5067.pdf. ↩