MACRO X COMPONENT PACKAGE
Macro X Component Package
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Contents
1. Overview
Name | |
Image |  |
Synonyms | |
Similar To | |
Variants | |
Mounting | - |
Pin Count | 4 |
Pitch | |
Solderability | - |
Thermal Resistance | - |
Package Dimensions | - |
Typical PCB Land Area | - |
3D Models | - |
Common Uses |
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The Macro X` component package seems to be obsolete now (2022).
Microsemi’s BJT pinout for this package connected the longest lead to the collector, the lead opposite this to the base, and the other two leads to the emitter[1].
The Macro X package is similar to Macom’s CASE 305A-01 component package, used for the Macom MRF158 N-channel RF MOSFET[3].
References
[1] Microsemi (2008, Dec). MRF581: RF & Microwave Discrete Low Power Transistors (datasheet). Retrieved 2022-04-18, from https://www.microsemi.com/document-portal/doc_download/11675-mrf581-mrf581a-reva-datasheet.
[2] Digikey. Microsemi Corporation MRF581 (product page). Retrieved 2022-04-18, from https://www.digikey.com/en/products/detail/microsemi-corporation/MRF581/2077046.
[3] Macom. The Broadband RF TMOS Line, 2W, 500MHz, 28V. Retrieved 2022-04-19, from https://nz.mouser.com/datasheet/2/249/MRF158-318450.pdf.
Authors
This work is licensed under a Creative Commons Attribution 4.0 International License .
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