SOD-923 COMPONENT PACKAGE
SOD-923 Component Package
SOD-923 (Small Outline Diode 923)
Reflow is most suitable. Possible to hand solder/reflow as long as experienced.
Typical PCB Land Area
2. SOD-923 (Gull-wing Lead Variant)
The SOD-923 is similar to the SOD-923F, except the SOD-923 has pins protruding from the sides of the package and is not considered a "chip" package. The SOD-923 and SOD-923F have the same outer dimensions (when you include the pins in the SOD-923).
3. SOD-923F (Flat Lead Variant)
The SOD-923F is similar to the SOD-923, except that the SOD-923F does not have pins protruding past the end of the package and instead is a "chip" style package with the pins on the bottom face of the package. It is identical to the 0402 package commonly used for resistors and capacitor, however the
SOD-923F` designation is typically used for diodes whilst
0402 is used for chip resistors and capacitors.
 Toshiba Semiconductor. SOD-923. Retrieved 2021-12-14, from https://toshiba.semicon-storage.com/ap-en/semiconductor/design-development/package/detail.SOD-923.html.
 Central Semiconductor. Package Details: SOD-923 Case. Retrieved 2021-12-14, from https://www.centralsemi.com/PDFs/case/SOD-923PD.PDF.
 DigiKey. Comchip Technology CPDQR5V0U-HF (product page). Retrieved 2021-12-14, from https://www.digikey.in/en/products/detail/comchip-technology/CPDQR5V0U-HF/3308667.
 Comchip. Low VF SMD Schottky Barrier Diode: CDBQC0130L-HF (datasheet). Retrieved 2021-12-14, from https://www.comchiptech.com/admin/files/product/CDBQC0130L-HF%20RevB681116.pdf.
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