|Name||SON (Small-outline No-lead Package)|
|Variants||The SON package can have a varying number of pins. There are also VSON and WSON packages which are exactly the same as the SON package except for a different height.|
|Similar To||QFN (note that some may call SON a variant of QFN)|
|Pin Count||6, 8 (all also have exposed thermal pad)|
|Solderability||Hard to solder with a soldering iron due to underside thermal pad (some don't have a thermal pad, and in that case, your chances are better). The tiny pitch is not so much of an issue as unlike the TQFP package, solder bridges are really easy to remove. You can solder the exposed pad in some cases by drilling a hole in the centre of the pad and soldering from the underside.|
|3D Models||DSG (S-PWSON-N8)|
TI also calls this the Plastic Small Outline No-lead package.
The difference between the SON and QFN package is that the SON package only has pins running down two of it’s sides, while a QFN package has pins on all four sides. It is commonly referred to as the DFN (dual-flat no-lead) package.
JEDEC standard JESD75-5 specifies how generic logic circuits will be connected to certain pins of the SON package.
Below is an “odd shaped” SON package used by Numonyx flash chips that goes under the name VDFPN8. Notice the half-round appearance of the pins.
The SON package has a exposed thermal pad on the underside, similar to a QFN package.
For a comparable TQFP package with the same pin count, the SON package (with an exposed pad) can usually handle more than twice the power dissipation.
WSON And VSON Variants
The WSON and VSON variants of the SON package are identical to the SON package except for varying heights.
The WSON variant has a height of 0.80mm (max.)
The VSON variant has a height of 1.00mm (max.)
- LFCSP Component Package
- VQFN Component Package
- QFN Component Package
- USON Component Package
- D2PAK Component Package