SOT-883 COMPONENT PACKAGE

SOT-883 Component Package

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Date Published:	October 15, 2020
Last Modified:	April 3, 2022

1. Overview

Name

SOT-883 (Small-outline Transistor 883)

Image

Synonyms

CASE 506DB (onsemi[3])
DFN1006-3 (NXP[1])
SC-101 (JEITA, EIAJ)[2]
XDFN3 (onsemi)

Similar To

DFN
SOD-882 (2 pins instead of 3, in the same sized package)

Variants

None

Mounting

SMD

Pin Count

Pitch

0.35mm between the centers of the two small pads (called the nominal pitch by Nexperia)[1]
0.65mm between the centers of the small pads and the large pad (called the minimal pitch by Nexperia)[1]

Solderability

Almost impossible to solder with a hand-held soldering iron due to the pads being on the bottom of the package. Need to use reflow oven/hot air soldering techniques.

Thermal Resistance

Package Dimensions

Length: 1.0mm (nom)[1]
Width: 0.6mm (nom)[1]
Height: 0.50mm (nom)[1]

Typical PCB Land Area

\(1.17mm^2\) (1.30x0.90mm)[1]

3D Models

Common Uses

MOSFETs

The SOT-883 component package is very similar to a DFN package. It is also very similar to the SOD-882 component package (note: that’s SOD, not SOT!). It has the same outside dimensions as the SOD-882, except with the addition of an extra pad. This presumably explains the transition from SOD to SOT — the two pin package is used for diodes, whilst this three pin package is used for transistors.

onsemi (formally On Semiconductor) calls this package the XDFN3[3]. However, you have to be careful as onsemi also uses the name XDFN3 for slightly different packages, for example, the NTNS5K0P021Z MOSFET, which has a smaller package size of 0.62x0.42x0.4mm[4], rather than 1.0x0.6x0.5mm of the SOT-883. The key difference is the "case code" which is CASE 506CB1[3] for the SOT-883, but CASE 711BH[4] for the smaller 0.62x0.42x0.4mm package.

2. 3D Render

Figure 1. A 3D render of the SOT-883 component package. Image from https://assets.nexperia.com/documents/package-information/SOT883.pdf.

3. Package Dimensions

Figure 2. The dimensions of the SOT-883 component package. Image from https://assets.nexperia.com/documents/package-information/SOT883.pdf.

4. Recommended Footprint

sot 883 component package recommended footprint

Figure 3. The recommended PCB footprint for the SOT-883 component package. Image from https://assets.nexperia.com/documents/package-information/SOT883.pdf.

References

[1] Nexperia (2020, Sep 25). SOT883: plastic, leadless ultra small package; 3 terminals; 0.35 mm pitch; 1 mm x 0.6 mm x 0.48 mm body (package information). Retrieved 2022-04-02, from https://assets.nexperia.com/documents/package-information/SOT883.pdf.
[2] NXP (now Nexperia) (2003, Jun 17). PBSS2515M: 15 V, 0.5 A NPN low VCEsat (BISS) transistor (datasheet). Retrieved 2022-04-03, from https://assets.nexperia.com/documents/data-sheet/PBSS2515M.pdf.
[3] On Semiconductor (now onsemi) (2019, Jun). NTNS3C68NZ: MOSFET - Single, N-Channel, Small Signal, SOT-883, (XDFN3), 1.0 x 0.6 x 0.4 mm 12 V, 758 mA (datasheet). Retrieved 2022-04-03, from https://www.onsemi.com/pdf/datasheet/ntns3c68nz-d.pdf.
[4] On Semiconductor (now onsemi) (2019, Jun). NTNS5K0P021Z: MOSFET - Single P-Channel, Small Signal, XDFN3, 0.62 x 0.42 x 0.4 mm, -20 V, -127 mA (datasheet). Retrieved 2022-04-03, from https://www.onsemi.com/pdf/datasheet/ntns5k0p021z-d.pdf.

Authors

Geoffrey Hunter

Dude making stuff.

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