COMPONENT PACKAGES
SOT-346 Component Package
| Date Published: | |
| Last Modified: |
Overview
| Name | SOT-346 (Small Outline Transistor 346) |
| Synonyms |
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| Variants | |
| Similar To | n/a |
| Mounting | SMD |
| Pin Count | 3 |
| Pitch | 1.90mm |
| Solderability | Easy to hand-solder if you have had a bit of practise with surface mount devices before. Easy to solder with infrared or reflow techniques. |
| Thermal Resistance | 500°C/W (standard mounting conditions) Datasheets rate BJT transistors in the SOT-346 package, mounted on a standard footprint, to a maximum of 250mW heat dissipation. |
| Dimensions | Body = 2.9x1.5mm Component Area = 7.98mm² (2.9x2.75mm) Standard Footprint Land Area = 11.22mm² (3.3x3.4mm) |
| 3D Models | n/a |
| Common Uses | BJT transistors |
Outline And Dimensions
Below is the outline and dimensions of the SOT-346 component package as specified by NXP Semiconductors.
Footprint
Below is the recommended reflow soldering footprint by NXP Semiconductors.
A recommended reflow soldering footprint (land pattern) for the SOT-346 (SC-59A) component package. Image from http://www.nxp.com/.
