COMPONENT PACKAGES

SOT-346 Component Package

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Overview

NameSOT-346 (Small Outline Transistor 346)
Synonyms
  • SC-59 (EIAJ)
  • SC-59A (EIAJ)
  • TO-236 (JEDEC)
  • SMT3 (NXP Semiconductors)
  • MPAK (NXP Semiconductors)
Variants
Similar Ton/a
MountingSMD
Pin Count3
Pitch1.90mm
SolderabilityEasy to hand-solder if you have had a bit of practise with surface mount devices before. Easy to solder with infrared or reflow techniques.
Thermal Resistance500°C/W (standard mounting conditions) Datasheets rate BJT transistors in the SOT-346 package, mounted on a standard footprint, to a maximum of 250mW heat dissipation.
DimensionsBody = 2.9x1.5mm Component Area = 7.98mm² (2.9x2.75mm) Standard Footprint Land Area = 11.22mm² (3.3x3.4mm)
3D Modelsn/a
Common UsesBJT transistors

Outline And Dimensions

Below is the outline and dimensions of the SOT-346 component package as specified by NXP Semiconductors.

The outline and dimensions of the SOT-346 component package. Image from http://www.nxp.com/.

The outline and dimensions of the SOT-346 component package. Image from http://www.nxp.com/.

Footprint

Below is the recommended reflow soldering footprint by NXP Semiconductors.

A recommended reflow soldering footprint (land pattern) for the SOT-346 (SC-59A) component package. Image from http://www.nxp.com/.

A recommended reflow soldering footprint (land pattern) for the SOT-346 (SC-59A) component package. Image from http://www.nxp.com/.

3D Render

A 3D render of the SOT-346 (SC-59A) component package.

A 3D render of the SOT-346 (SC-59A) component package.

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