COMPONENT PACKAGES

TO-Leadless Component Package

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Overview

Name TO-Leadless (Transistor Outline Leadless)
Synonyms n/a
Variants n/a
Similar To n/a
Mounting SMD
Pin Count 8 + exposed pad
Pitch 1.20mm
Solderability Not suitable for hand soldering due to pads underneath the package. Suitable for hot air and reflow soldering techniques.
Thermal Resistance
  • \(R_{JC} = 0.4^{\circ}{\rm C}/W\)
  • \(R_{JA} = 40^{\circ}{\rm C}/W\) (max)
Dimensions 11.7x9.9x2.3mm
Land Area 116mm2
3D Models n/a
Common Uses High-power MOSFETs (e.g. with 300A current capability)

Comments

As far as I know, the TO-Leadless package is solely used by Infineon for a range of it’s high power MOSFETs. In this package, Infineon’s MOSFETs can achieve on-resistances as low as 0.4mΩ. It’s package size is 60% smaller than the D2PAK 7-pin package.

3D Render

A 3D render of the TO-Leadless component package.

A 3D render of the TO-Leadless component package.

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