COMPONENT PACKAGES

TO-Leadless Component Package

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Overview

NameTO-Leadless (Transistor Outline Leadless)
Synonymsn/a
Variantsn/a
Similar Ton/a
MountingSMD
Pin Count8 + exposed pad
Pitch1.20mm
SolderabilityNot suitable for hand soldering due to pads underneath the package. Suitable for hot air and reflow soldering techniques.
Thermal Resistance
  • \(R_{JC} = 0.4^{\circ}{\rm C}/W\)
  • \(R_{JA} = 40^{\circ}{\rm C}/W\) (max)
Dimensions11.7x9.9x2.3mm
Land Area116mm2
3D Modelsn/a
Common UsesHigh-power MOSFETs (e.g. with 300A current capability)

Comments

As far as I know, the TO-Leadless package is solely used by Infineon for a range of it’s high power MOSFETs. In this package, Infineons MOSFETs can achieve on-resistances as low as 0.4mΩ. It’s package size is 60% smaller than the D2PAK 7-pin package.

3D Render

A 3D render of the TO-Leadless component package.

A 3D render of the TO-Leadless component package.

Images


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