|Name||TO-Leadless (Transistor Outline Leadless)|
|Pin Count||8 + exposed pad|
|Solderability||Not suitable for hand soldering due to pads underneath the package. Suitable for hot air and reflow soldering techniques.|
|Common Uses||High-power MOSFETs (e.g. with 300A current capability)|
As far as I know, the TO-Leadless package is solely used by Infineon for a range of it’s high power MOSFETs. In this package, Infineon’s MOSFETs can achieve on-resistances as low as 0.4mΩ. It’s package size is 60% smaller than the D2PAK 7-pin package.
This work is licensed under a Creative Commons Attribution 4.0 International License .
- TO-273AA Component Package
- SOT-665 Component Package
- TO-5 Component Package
- TO-205AD Component Package
- TO-279 Component Package