TO-Leadless Component Package
Article by:Geoffrey Hunter
|Name||TO-Leadless (Transistor Outline Leadless)|
|Pin Count||8 + exposed pad|
|Solderability||Not suitable for hand soldering due to pads underneath the package. Suitable for hot air and reflow soldering techniques.|
|Common Uses||High-power MOSFETs (e.g. with 300A current capability)|
As far as I know, the TO-Leadless package is solely used by Infineon for a range of it’s high power MOSFETs. In this package, Infineon’s MOSFETs can achieve on-resistances as low as 0.4mΩ. It’s package size is 60% smaller than the D2PAK 7-pin package.
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