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TO-Leadless Component Package

Geoffrey Hunter
Geoffrey Hunter
mbedded.ninja Author

Overview​

A 3D render of the TO-Leadless component package.

TO-Leadless is a component package is solely used by Infineon for a range of it's high power MOSFETs1. In this package, Infineon's MOSFETs can achieve on-resistances as low as 0.4mΩ. It's package size is 60% smaller than the D2PAK 7-pin package.

The package has 8 leads plus and exposed pad2.

Below is a size comparison between DPAK (left) and TO-Leadless (right):

Size comparison between the TO-Leadless and DPAK component packages.

Synonyms​

  • PG-HSOF-8: Infineon name2.

Dimensions​

The dimensions of the TO-Leadless component package.

Footprint​

The recommended land pattern for the TO-Leadless component package.
The recommended stencil pattern for the TO-Leadless component package.

Solderability​

Not suitable for hand soldering due to pads underneath the package. Suitable for hot air and reflow soldering techniques

Thermal Resistance​

  • RJC=0.4∘C/WR_{JC} = 0.4^{\circ}{\rm C}/W
  • RJA=40∘C/WR_{JA} = 40^{\circ}{\rm C}/W (max)

Footnotes​

  1. Infineon. TO-Leadless (TOLL) OptiMOS™ package. Retrieved 2024-04-22, from https://www.infineon.com/cms/en/product/power/mosfet/n-channel/optimos-and-strongirfet-latest-packages/to-leadless/. ↩

  2. Infineon. IPT026N10N5 - MOSFET - OptiMOS 5 Power-Transistor, 100V [datasheet]. Retrieved 2024-04-22, from https://www.infineon.com/dgdl/Infineon-IPT026N10N5-DS-v02_01-EN.pdf?fileId=5546d46269e1c019016ac029615332f7. ↩ ↩2