TO-Leadless Component Package

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Overview

A 3D render of the TO-Leadless component package.

A 3D render of the TO-Leadless component package.

TO-Leadless is a component package is solely used by Infineon for a range of it’s high power MOSFETs1. In this package, Infineon’s MOSFETs can achieve on-resistances as low as 0.4mΩ. It’s package size is 60% smaller than the D2PAK 7-pin package.

The package has 8 leads plus and exposed pad2.

Below is a size comparison between DPAK (left) and TO-Leadless (right):

Size comparison between the TO-Leadless and DPAK component packages.

Size comparison between the TO-Leadless and DPAK component packages.

Synonyms

  • PG-HSOF-8: Infineon name2.

Dimensions

The dimensions of the TO-Leadless component package.

The dimensions of the TO-Leadless component package.

Footprint

The recommended land pattern for the TO-Leadless component package.

The recommended land pattern for the TO-Leadless component package.

The recommended stencil pattern for the TO-Leadless component package.

The recommended stencil pattern for the TO-Leadless component package.

Solderability

Not suitable for hand soldering due to pads underneath the package. Suitable for hot air and reflow soldering techniques

Thermal Resistance

  • \(R_{JC} = 0.4^{\circ}{\rm C}/W\)
  • \(R_{JA} = 40^{\circ}{\rm C}/W\) (max)

References


  1. Infineon. TO-Leadless (TOLL) OptiMOS™ package. Retrieved 2024-04-22, from https://www.infineon.com/cms/en/product/power/mosfet/n-channel/optimos-and-strongirfet-latest-packages/to-leadless/↩︎

  2. Infineon. IPT026N10N5 - MOSFET - OptiMOS 5 Power-Transistor, 100V [datasheet]. Retrieved 2024-04-22, from https://www.infineon.com/dgdl/Infineon-IPT026N10N5-DS-v02_01-EN.pdf?fileId=5546d46269e1c019016ac029615332f7↩︎ ↩︎


Authors

Geoffrey Hunter

Dude making stuff.

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License .

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