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X-Ray Inspection

Authors:
Geoffrey Hunter
Geoffrey Hunter
Published On:
Oct 29, 2026
Last Updated:
Oct 29, 2026

X-ray inspection is used to see inside assembled PCBs. It is most commonly used to inspect solder joints that are hidden from view, such as those under BGA and other bottom-terminated components (such as those with thermal pads), which can’t be checked with standard optical inspection.

Left: A render of a tiny Texas Instruments BGA-4 package (0.89x0.89mm, 2x2 balls at 0.5mm pitch). Right: An X-ray image of a PCB with this package soldered to it (highlighted in red). The four solder balls are visible as dark dots, along with the copper traces, vias and the leads of other components.

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