Reflow is required. Not possible to solder with iron as package has a large thermal pad on the underside, and a very small amount of the pads are exposed.
Typical PCB Land Area
The PowerPAK SO-8 package is designed with the same pin spacing as the SO-8 package, except with pins 5-8 connected together with an additional thermal pad on the underside of the package. Although it is recommended to design a special footprint for this package to take advantage of the thermal pad, it can be soldered onto existing SO-8 land patterns.
 Vishay Siliconix (2009, Apr 6). Si7846DP: N-Channel 150-V (D-S) MOSFET. Retrieved 2021-10-13, from https://www.vishay.com/docs/71442/71442.pdf.
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