PowerPAK SO-8 Component Package

Geoffrey Hunter

mbedded.ninja Author

Overview

The PowerPAK SO-8 package is designed with the same pin spacing as the SO-8 package, except with pins 5-8 connected together with an additional thermal pad on the underside of the package. Although it is recommended to design a special footprint for this package to take advantage of the thermal pad, it can be soldered onto existing SO-8 land patterns¹.

Pin Count: 8¹

Pitch: 1.27mm¹

Solderability: Reflow is required. Not possible to solder with iron as package has a large thermal pad on the underside, and a very small amount of the pads are exposed.

Thermal Resistance: $R_{\theta JC}=1^{\circ}C/W$¹

Package LxWxH: 6.05x5.05x1.04mm¹

Typical PCB Land Area: $29.2mm^2$ ($6.61x4.42mm$)¹

Common Uses:

• MOSFETs

Footnotes

1. Vishay Siliconix (2009, Apr 6). Si7846DP: N-Channel 150-V (D-S) MOSFET. Retrieved 2021-10-13, from https://www.vishay.com/docs/71442/71442.pdf. ↩ ↩² ↩³ ↩⁴ ↩⁵ ↩⁶