POWERPAK SO-8 COMPONENT PACKAGE
PowerPAK SO-8 Component Package
Article by:Geoffrey Hunter
Date Published: | |
Last Modified: |
Overview
The PowerPAK SO-8
package is designed with the same pin spacing as the SO-8 package, except with pins 5-8 connected together with an additional thermal pad on the underside of the package. Although it is recommended to design a special footprint for this package to take advantage of the thermal pad, it can be soldered onto existing SO-8 land patterns1.
Pin Count: 81
Pitch: 1.27mm1
Solderability: Reflow is required. Not possible to solder with iron as package has a large thermal pad on the underside, and a very small amount of the pads are exposed.
Thermal Resistance: \(R_{\theta JC}=1^{\circ}C/W\)
1
Package LxWxH: 6.05x5.05x1.04mm1
Typical PCB Land Area: \(29.2mm^2\)
(\(6.61x4.42mm\)
)1
Common Uses:
- MOSFETs
References
Authors

This work is licensed under a Creative Commons Attribution 4.0 International License .
Related Content:
- SC-101 Component Package
- D2PAK Component Package
- DDPAK Component Package
- SMD-220 Component Package
- TO-236AA Component Package