POWERPAK SO-8 COMPONENT PACKAGE
PowerPAK SO-8 Component Package
Date Published: | |
Last Modified: |
Contents
1. Overview
Name |
PowerPAK SO-8 |
Synonyms |
|
Similar To |
n/a |
Mounting |
SMD |
Pin Count |
8[1] |
Pitch |
|
Solderability |
Reflow is required. Not possible to solder with iron as package has a large thermal pad on the underside, and a very small amount of the pads are exposed. |
Thermal Resistance |
\(R_{\theta JC}=1^{\circ}C/W\)[1] |
Package LxWxH |
6.05x5.05x1.04mm[1] |
Typical PCB Land Area |
\(29.2mm^2\) (\(6.61x4.42mm\))[1] |
3D Models |
|
Common Uses |
|
The PowerPAK SO-8 package is designed with the same pin spacing as the SO-8 package, except with pins 5-8 connected together with an additional thermal pad on the underside of the package. Although it is recommended to design a special footprint for this package to take advantage of the thermal pad, it can be soldered onto existing SO-8 land patterns[1].
References
[1] Vishay Siliconix (2009, Apr 6). Si7846DP: N-Channel 150-V (D-S) MOSFET. Retrieved 2021-10-13, from https://www.vishay.com/docs/71442/71442.pdf.
Authors

This work is licensed under a Creative Commons Attribution 4.0 International License .
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