POWERPAK SO-8 COMPONENT PACKAGE

# PowerPAK SO-8 Component Package

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 Date Published: October 13, 2021 Last Modified: October 13, 2021

## 1. Overview

 Name PowerPAK SO-8 Synonyms n/a Similar To n/a Mounting SMD Pin Count 8[1] Pitch 1.27mm[1] Solderability Reflow is required. Not possible to solder with iron as package has a large thermal pad on the underside, and a very small amount of the pads are exposed. Thermal Resistance $$R_{\theta JC}=1^{\circ}C/W$$[1] Package LxWxH 6.05x5.05x1.04mm[1] Typical PCB Land Area $$29.2mm^2$$ ($$6.61x4.42mm$$)[1] 3D Models n/a Common Uses MOSFETs

The PowerPAK SO-8 package is designed with the same pin spacing as the SO-8 package, except with pins 5-8 connected together with an additional thermal pad on the underside of the package. Although it is recommended to design a special footprint for this package to take advantage of the thermal pad, it can be soldered onto existing SO-8 land patterns[1].

## Authors

### Geoffrey Hunter

Dude making stuff.