PowerPAK SO-8 package is designed with the same pin spacing as the SO-8 package, except with pins 5-8 connected together with an additional thermal pad on the underside of the package. Although it is recommended to design a special footprint for this package to take advantage of the thermal pad, it can be soldered onto existing SO-8 land patterns1.
Pin Count: 81
Solderability: Reflow is required. Not possible to solder with iron as package has a large thermal pad on the underside, and a very small amount of the pads are exposed.
Package LxWxH: 6.05x5.05x1.04mm1
Typical PCB Land Area:
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