POWERPAK SO-8 COMPONENT PACKAGE

PowerPAK SO-8 Component Package

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Date Published:	October 13, 2021
Last Modified:	October 13, 2021

1. Overview

Name

PowerPAK SO-8

Synonyms

Similar To

n/a

Mounting

SMD

Pin Count

8[1]

Pitch

1.27mm[1]

Solderability

Reflow is required. Not possible to solder with iron as package has a large thermal pad on the underside, and a very small amount of the pads are exposed.

Thermal Resistance

\(R_{\theta JC}=1^{\circ}C/W\)[1]

Package LxWxH

6.05x5.05x1.04mm[1]

Typical PCB Land Area

\(29.2mm^2\) (\(6.61x4.42mm\))[1]

3D Models

Common Uses

MOSFETs

The PowerPAK SO-8 package is designed with the same pin spacing as the SO-8 package, except with pins 5-8 connected together with an additional thermal pad on the underside of the package. Although it is recommended to design a special footprint for this package to take advantage of the thermal pad, it can be soldered onto existing SO-8 land patterns[1].