COMPONENT PACKAGES
SPM23 Component Package
Article by:Geoffrey Hunter
Date Published: | |
Last Modified: |
Overview
Name | Smart Power Module |
Synonyms | n/a |
Variants | n/a |
Similar To | Mini-DIP SPM |
Mounting | SMD |
Pin Count | 23 |
Pitch | n/a |
Solderability | Easy to solder by hand, infrared or reflow techniques. |
Thermal Resistance | n/a |
Land Area | n/a |
Height | 3.1mm |
3D Models | n/a |
Common Uses |
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Comments
Package proprietary to Fairchild Semiconductor, used for some of their motor driver ICs. Similar to a through-hole version called the Mini-DIP SPM. The package is designed to have a large flat top surface for heat sinking.
Photos
Recommended Land Pattern (Footprint)
Authors

This work is licensed under a Creative Commons Attribution 4.0 International License .
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