COMPONENT PACKAGES

SPM23 Component Package

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Date Published:	April 6, 2015
Last Modified:	April 6, 2015

Overview

Name	Smart Power Module
Synonyms	n/a
Variants	n/a
Similar To	Mini-DIP SPM
Mounting	SMD
Pin Count	23
Pitch	n/a
Solderability	Easy to solder by hand, infrared or reflow techniques.
Thermal Resistance	n/a
Land Area	n/a
Height	3.1mm
3D Models	n/a
Common Uses	Motor drivers Inverters

Comments

Package proprietary to Fairchild Semiconductor, used for some of their motor driver ICs. Similar to a through-hole version called the Mini-DIP SPM. The package is designed to have a large flat top surface for heat sinking.