COMPONENT PACKAGES

SPM23 Component Package

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Overview

Name Smart Power Module
Synonyms n/a
Variants n/a
Similar To Mini-DIP SPM
Mounting SMD
Pin Count 23
Pitch n/a
Solderability Easy to solder by hand, infrared or reflow techniques.
Thermal Resistance n/a
Land Area n/a
Height 3.1mm
3D Models n/a
Common Uses
  • Motor drivers
  • Inverters

Comments

Package proprietary to Fairchild Semiconductor, used for some of their motor driver ICs. Similar to a through-hole version called the Mini-DIP SPM. The package is designed to have a large flat top surface for heat sinking.

Photos

A photo of the SPM23 component package.

A photo of the SPM23 component package.

The land pattern for the SPM-23 component package.

The land pattern for the SPM-23 component package.


Authors

Geoffrey Hunter

Dude making stuff.

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License .

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