|Name||Smart Power Module|
|Similar To||Mini-DIP SPM|
|Solderability||Easy to solder by hand, infrared or reflow techniques.|
Package proprietary to Fairchild Semiconductor, used for some of their motor driver ICs. Similar to a through-hole version called the Mini-DIP SPM. The package is designed to have a large flat top surface for heat sinking.
Recommended Land Pattern (Footprint)
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