COMPONENT PACKAGES
SPM23 Component Package
Article by:Geoffrey Hunter
| Date Published: | |
| Last Modified: |
Contents
Overview
| Name | Smart Power Module |
| Synonyms | n/a |
| Variants | n/a |
| Similar To | Mini-DIP SPM |
| Mounting | SMD |
| Pin Count | 23 |
| Pitch | n/a |
| Solderability | Easy to solder by hand, infrared or reflow techniques. |
| Thermal Resistance | n/a |
| Land Area | n/a |
| Height | 3.1mm |
| 3D Models | n/a |
| Common Uses |
|
Comments
Package proprietary to Fairchild Semiconductor, used for some of their motor driver ICs. Similar to a through-hole version called the Mini-DIP SPM. The package is designed to have a large flat top surface for heat sinking.
Photos
Recommended Land Pattern (Footprint)
Authors
This work is licensed under a Creative Commons Attribution 4.0 International License .
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