COMPONENT PACKAGES

SPM23 Component Package

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Last Modified:

Overview

NameSmart Power Module
Synonymsn/a
Variantsn/a
Similar ToMini-DIP SPM
MountingSMD
Pin Count23
Pitchn/a
SolderabilityEasy to solder by hand, infrared or reflow techniques.
Thermal Resistancen/a
Land Arean/a
Height3.1mm
3D Modelsn/a
Common Uses
  • Motor drivers
  • Inverters

Comments

Package proprietary to Fairchild Semiconductor, used for some of their motor driver IC’s. Similar to a through-hole version called the Mini-DIP SPM. The package is designed to have a large flat top surface for heat sinking.

Photos

A photo of the SPM23 component package.

A photo of the SPM23 component package.

Images

The land pattern for the SPM-23 component package.

The land pattern for the SPM-23 component package.


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