COMPONENT PACKAGES

MSOP Component Package

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Date Published:	January 8, 2015
Last Modified:	January 8, 2015

Overview

Name	Micro Small Outline Package
Synonyms	Micro SOP RM-8, RM-10 (Analog Devices, no pad) MINISOEP, RH-8-1, RH-10-1 (Analog Devices, with pad) MSE (Linear Technology) uSOP (Maxim Integrated) uMAX (Maxim Integrated) u8+1 (Maxim Integrated package code for MSOP-8 P0.65mm)
Variants	n/a
Similar To	MSOP SSOP TSSOP
Mounting	SMD
Lead-type	Gull-wing
Pin Count	8-16
Pitch	0.50mm (MSOP-16) 0.65mm (uMAX, uSOP)
Solderability	Moderately difficult to solder by hand, due to the small pitch. Easy to solder with hot air, infrared, or reflow techniques.
Thermal Resistance	n/a
Dimensions	4.9x3.0x1.1mm (LA: 14.7mm2) MSOP-10: 3.0x3.0mm, LA = 9.0mm2
Height	1.10mm
3D Models	MSOP-10 IPC-7351 All SOIC SOP HSOP QSOP MSOP VSOP TVSOP SSOP TSSOP 250 packages uMAX-8
Common Uses	Audio amplifiers (Analog Devices) LED Controllers (Linear Technology)

The MSOP package is a miniaturized version of the SSOP package.

The width of any MSOP package is always 3mm. The length is also commonly 3mm (except for MSOP-16). Because of this restriction, the pitch usually decreases as the pin count increases.

The exposed pad on this package is optional (Analog Devices have separate codes for each).

Thermal Resistances

MSOP-10

Synonyms: DGS (Texas Instruments), VSSOP-10 (Texas Instruments)

Symbol	Description	Value
\( R_{\theta JA} \)	Junction-to-ambient	\(171.4^{\circ}C/W\)
\( R_{\theta JC(top)} \)	Junction-to-case (top)	\(42.9^{\circ}C/W\)
\( R_{\theta JB)} \)	Junction-to-board	\(91.8^{\circ}C/W\)