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MSOP Component Package

Geoffrey Hunter
mbedded.ninja Author

Overview

MSOP (Mini Small Outline Package)1 is a family of SMD component packages with gull-wing leads. The family is a miniaturized version of the SSOP package. There are a few common variants in the MSOP family, the MSOP-8, MSOP-10, and MSOP-16.

The exposed pad on this package is optional (Analog Devices have separate codes for each).

MSOP-8

MSOP-8 is the 8-lead variant in the MSOP family.

3D model of the MSOP-8 component package (with exposed pad).

Synonyms

  • RM-8: Analog Devices, no pad2.
  • uMAX: Maxim Integrated3.
  • uSOP: Maxim Integrated3.

Dimensions

Package dimensions of the MSOP-8 component package (with exposed pad).

The MSOP-8 body is 3x3mmm. When you take into account the length of the leads the body width extends out to 4.9 mm.

Dimension NameDimension LetterValue
Body lengthDD3.0 mm
Body widthEE3.0 mm
Body width incl. leadsHeH_e4.9 mm
Pitchee0.65 mm

MSOP-10

MSOP-10 is the 10-lead variant in the MSOP family.

Synonyms

  • MSE: Linear Technology/Analog Devices4.
  • RM-10: Analog Devices, no pad.

Dimensions

Package dimensions of the MSOP-10 component package (with exposed pad).

Footprint

The footprint for the MSOP-10 component package.

MSOP-16

The MSOP-16 pitch is 0.50 mm which differs from the 0.65 mm used for the MSOP-8 and MSOP-10.

Similar To

Footnotes

  1. Wikipedia. Mini Small Outline Package. Retrieved 2024-04-29, from https://en.wikipedia.org/wiki/Mini_Small_Outline_Package.

  2. Analog Devices. 8-Lead Mini Small Outline Package [MSOP] (RM-8). Retrieved 2024-04-29, from https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/msoprm/rm_8.pdf.

  3. Maxim Integrated. Package Outline - 8L uMAX/uSOP. Retrieved 2024-04-29, from https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/micromax/21-0036.pdf. 2

  4. Analog Devices. MSE Package - 10-Lead Plastic MSOP, Exposed Die Pad. Retrieved 2024-04-29, from https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081664_i_mse.pdf.