COMPONENT PACKAGES

MSOP Component Package

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Last Modified:

Overview

NameMicro Small Outline Package
Synonyms
  • Micro SOP
  • RM-8, RM-10 (Analog Devices, no pad)
  • MINISOEP, RH-8-1, RH-10-1 (Analog Devices, with pad)
  • MSE (Linear Technology)
  • uSOP (Maxim Integrated)
  • uMAX (Maxim Integrated)
  • u8+1 (Maxim Integrated package code for MSOP-8 P0.65mm)
Variantsn/a
Similar ToSSOP
MountingSMD
Lead-typeGull-wing
Pin Count8-16
Pitch
  • 0.50mm (MSOP-16)
  • 0.65mm (uMAX, uSOP)
SolderabilityModerately difficult to solder by hand, due to the small pitch. Easy to solder with hot air, infrared, or reflow techniques.
Thermal Resistancen/a
Dimensions
  • 4.9x3.0x1.1mm (LA: 14.7mm2)
  • MSOP-10: 3.0x3.0mm, LA = 9.0mm2
Height1.10mm
3D Models
Common Uses
  • Audio amplifiers (Analog Devices)
  • LED Controllers (Linear Technology)

Comments

The width of any MSOP package is always 3mm. The length is also commonly 3mm (except for MSOP-16). Because of this restriction, the pitch usually decreases as the pin count increases.

The exposed pad on this package is optional (Analog Devices have separate codes for each).

Thermal Resistances

MSOP-10

Synonyms: DGS (Texas Instruments), VSSOP-10 (Texas Instruments)

SymbolDescriptionValue
\( R_{\theta JA} \)Junction-to-ambient\(171.4^{\circ}C/W\)
\( R_{\theta JC(top)} \)Junction-to-case (top)\(42.9^{\circ}C/W\)
\( R_{\theta JB)} \)Junction-to-board\(91.8^{\circ}C/W\)

MSOP-8

3D model of the MSOP-8 component package (with exposed pad).

3D model of the MSOP-8 component package (with exposed pad).

Package dimensions of the MSOP-8 component package (with exposed pad).

Package dimensions of the MSOP-8 component package (with exposed pad).

MSOP-10

Package dimensions of the MSOP-10 component package (with exposed pad).

Package dimensions of the MSOP-10 component package (with exposed pad).

The recommeneded land pattern for the MSOP-10 component package.

The recommeneded land pattern for the MSOP-10 component package.


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