POWERDI123 COMPONENT PACKAGE

PowerDI123 Component Package

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Overview

NamePowerDI123
Synonymsn/a
Variantsn/a
Similar ToSOD-123
MountingSMD
Pin Count2
Pitch3.05mm
SolderabilityEasy enough to solder by hand.
Thermal Resistance

Device mounted on 25.4x25.4mm FR-4 PCB (10x10mm 1oz copper, minimum recommended pad layout on top layer and thermal vias to bottom layer ground plane)[^al5809-datasheet]:

  • \( T_{JC} = 27.15°C/W \)
  • \( T_{JA} = 148.61°C/W \)

When mounted on 50.8mm x 50.8mm GETEK PCB with 25.4mm x 25.4mm copper pads[^al5809-datasheet]:

  • \( T_{JC} = 17.81°C/W \)
  • \( T_{JA} = 81.39°C/W \)
Dimensions2.8x1.78x0.98mm
PCB Footprint6.75mm2
3D Modelsn/a
Common Uses
  • Diodes
  • Constant-current LED drivers (shunt style)

PowerDI123 is a proprietary package by Diodes Incorporated.

Dimensions

The dimensions for the PowerDI123 component package. Image from https://www.diodes.com/assets/Package-Files/PowerDI123-Type-B.pdf.

The dimensions for the PowerDI123 component package. Image from https://www.diodes.com/assets/Package-Files/PowerDI123-Type-B.pdf.

The recommended footprint for the PowerDI123 component package. Image from https://www.diodes.com/assets/Package-Files/PowerDI123-Type-B.pdf.

The recommended footprint for the PowerDI123 component package. Image from https://www.diodes.com/assets/Package-Files/PowerDI123-Type-B.pdf.

References


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