POWERDI123 COMPONENT PACKAGE
PowerDI123 Component Package
Article by:Geoffrey Hunter
Date Published: | |
Last Modified: |
Contents
Overview
Name | PowerDI123 |
Synonyms | n/a |
Variants | n/a |
Similar To | SOD-123 |
Mounting | SMD |
Pin Count | 2 |
Pitch | 3.05mm |
Solderability | Easy enough to solder by hand. |
Thermal Resistance | Device mounted on 25.4x25.4mm FR-4 PCB (10x10mm 1oz copper, minimum recommended pad layout on top layer and thermal vias to bottom layer ground plane)[^al5809-datasheet]:
When mounted on 50.8mm x 50.8mm GETEK PCB with 25.4mm x 25.4mm copper pads[^al5809-datasheet]:
|
Dimensions | 2.8x1.78x0.98mm |
PCB Footprint | 6.75mm2 |
3D Models | n/a |
Common Uses |
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PowerDI123 is a proprietary package by Diodes Incorporated.
Dimensions

The dimensions for the PowerDI123 component package. Image from https://www.diodes.com/assets/Package-Files/PowerDI123-Type-B.pdf.
Recommended Footprint

The recommended footprint for the PowerDI123 component package. Image from https://www.diodes.com/assets/Package-Files/PowerDI123-Type-B.pdf.
References
Authors

This work is licensed under a Creative Commons Attribution 4.0 International License .
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