PowerDI123 Component Package

Device mounted on 25.4x25.4mm FR-4 PCB (10x10mm 1oz copper, minimum recommended pad layout on top layer and thermal vias to bottom layer ground plane)[^al5809-datasheet]:

• \( T_{JC} = 27.15°C/W \)
• \( T_{JA} = 148.61°C/W \)

When mounted on 50.8mm x 50.8mm GETEK PCB with 25.4mm x 25.4mm copper pads[^al5809-datasheet]:

• \( T_{JC} = 17.81°C/W \)
• \( T_{JA} = 81.39°C/W \)

• Diodes
• Constant-current LED drivers (shunt style)