DSOP ADVANCE COMPONENT PACKAGE

DSOP Advance Component Package

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Overview

NameDSOP Advance Component Package
Synonyms2-5S1A (Toshiba)
Variantsn/a
Similar To
MountingSMD
Lead-typePad
Pin Count10 (8 if you don't count the two pins by themselves)
Pitch1.27mm
SolderabilityModerately difficult to solder by hand, due to the small pitch. Easy to solder with hot air, infrared, or reflow techniques.
Thermal Resistance
  • \(50^{\circ}C/W\) (device mounted copper PCB with large pads designed for heatsinking)
  • \(142^{\circ}C/W\) (device mounted on standard PCB with minimal pad land pattern)
DimensionsThe package is 5x6x0.73mm (nominal)
Weight98mg
3D Modelsn/a
Common UsesHigh-power Toshiba MOSFETs

Thermal Resistance

The DSOP Advance component package comes with dual-side cooling features to further decrease the thermal resistance compared to the SOP Advance component package.

Dimensions

The dimensions for the DSOP Advance component package.

The dimensions for the DSOP Advance component package.

The recommended land pattern for the DSOP Advance component package.

The recommended land pattern for the DSOP Advance component package.


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