|Name||DSOP Advance Component Package|
|Pin Count||10 (8 if you don't count the two pins by themselves)|
|Solderability||Moderately difficult to solder by hand, due to the small pitch. Easy to solder with hot air, infrared, or reflow techniques.|
|Dimensions||The package is 5x6x0.73mm (nominal)|
|Common Uses||High-power Toshiba MOSFETs|
The DSOP Advance component package comes with dual-side cooling features to further decrease the thermal resistance compared to the SOP Advance component package.