TO-252 (DPAK) Component Package

Overview

TO-252 (JEDEC Transistor Outline 252) is family of SMD component packages that is commonly used for things such as medium power MOSFETs and linear power regulators. There is a popular 3-lead variant also known as DPAK, along with 2 less commonly used 5-lead variants. In the “DPAK” range there is also the larger TO-263 (D2PAK) and TO-268 (D3PAK) offering higher power dissipation ratings.

All TO-252 packages have a pitch of 1.27mm (50mill). TO-252’s are quite easy to hand-solder, although the large tab can make things difficult because of it’s heatsinking capabilities.

Features a large tab/pin which can be soldered directly onto the PCB, providing good heatsinking capabilities.

Similar To

• TO-220: The through-hole package that the TO-252-3 was designed to replace (obviously not pin compatible!).
• TO-263 (D2PAK): The TO-263 (D2PAK) is the next step up in power dissipation from the TO-252-3 package.
• TO-268 (D3PAK): The TO-268 (D3PAK) is the next step up in power dissipation from the TO-263 (D2PAK) package.

TO-252-3

The TO-252-3 is the 3-lead variant in the TO-252 family, most commonly known by the synonym DPACK. ERROR: fig-to-252-component-package-3d-render REF NOT FOUND shows a 3D render of this package.

Synonyms:

• Case 369C: Used by On Semiconductor¹.
• CPD: Used by Rohm Semiconductor².
• DPAK: Popular alternative name.
• DPAK3: A version of DPAK but with a 3 to distinguish it from the 5-lead version.
• SC-63: The JEITA EIAJ standard name³.
• SOT-428: Used by Nexperia³.
• TO-252: Strictly this is a family of packages, but if no suffix is mentioned it’s typically referring to TO-252-3³.
• TO-252AA: JEDEC name.

3D Models:

• DPAK, TO-252AA, by Bill Brooks

Thermal resistance:

• \(T_{JA} = 80^{\circ}{\rm C}/W\) (pads only, no copper fill)

TO-252-5-P1

The TO-252-5 is the 5-lead variant in the TO-252 family with a square a shorter tab than the TO-252-5-P2. It is not as common as the 3-lead variant. Most of the time the middle lead (3rd lead) is cut short in this variant, as it’s electrically connected to the tab.

3D Model

ERROR: fig-to-252-5-p1-3d-model-diodes-inc REF NOT FOUND shows a 3D model for this component package.

You can download 3D models from:

• DPAK-5, by Alexey Olehnovich

Synonyms

• KVU (R-PSFM-G5): Used by Texas Instruments as a drawing number⁵.
• TO-252-5: Sometimes this package is just called TO-252-5.

Dimensions

ERROR: fig-to-252-p1-package-dimensions-diode-inc REF NOT FOUND shows the dimensions of the TO-252-5-P1 package from Diodes Inc.

Recommended Land Pattern

ERROR: fig-to-252-p1-recommended-land-pattern-diode-inc REF NOT FOUND shows the recommended land pattern of the TO-252-5-P1 package from Diodes Inc.

Thermal Resistances

The thermal resistances for any TO-252-5 package are shown below.

• \(T_{JA} = 59^{\circ}{\rm C}/W\) (pads only, no copper fill)
• \(T_{JA} = 26^{\circ}{\rm C}/W\) (high-wattage land pattern)
• \(T_{JA} = 20^{\circ}{\rm C}/W\) (one square inch of copper surrounding package, connected to ground)
• \(T_{JA} = 7^{\circ}{\rm C}/W\) (high-wattage land pattern with thermal vias to bottom layer)

TO-252-5-P2

The TO-252-5-P2 is a 5-lead variant of the TO-252 package with a rounded and longer tab than the TO-252-5-P1⁷. If there is no suffix listed on a TO-252-5 package (e.g. no mention of P1 or P2), it will likely be this variant. ERROR: fig-to-252-5-p2-3d-render-nisshinbo REF NOT FOUND shows a 3D render of this package.

Recommended Land Pattern

ERROR: fig-component-package-to-252-5-recommended-land-pattern REF NOT FOUND shows a recommended land pattern from Ricoh for the TO-252-5-P2.

References