USON COMPONENT PACKAGE
USON Component Package
Article by:
Geoffrey Hunter
| Date Published: | |
| Last Modified: |
Overview
| Name | USON (Plastic Ultra-Thin Small Outline No-lead Package, JEDEC) |
| Synonyms |
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| Variants | Varying number of pins. |
| Similar To | WSON |
| Mounting | SMD |
| Pin Count | 4 - 16 |
| Pitch | 0.5mm, 0.65mm (DNP, TI), 1.0mm (NLB, TI) |
| Solderability | Hard to solder with a soldering iron due to underside thermal pad. |
| Thermal Resistance | |
| Dimensions | |
| 3D Models |
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| Common Uses |
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The [http://www.ti.com/packaging/docs/searchtipackages.tsp?packageName=SON](Texas Instruments Package Search - SON) page contains information on all of the USON packages that TI components use.
A screenshot of all the USON packages that TI component use. Image from http://www.ti.com/packaging/docs/searchtipackages.tsp?packageName=SON.
The dimensions for the Texas Instruments DRN package (a variant of the USON package). Image from http://www.ti.com/lit/ml/mpds165a/mpds165a.pdf.
Authors
This work is licensed under a Creative Commons Attribution 4.0 International License .
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