COMPONENT PACKAGES
USON Component Package
Date Published: | |
Last Modified: |
Overview
Name | USON (Plastic Ultra-Thin Small Outline No-lead Package, JEDEC) |
Synonyms |
|
Variants | Varying number of pins. |
Similar To | WSON |
Mounting | SMD |
Pin Count | 4 - 16 |
Pitch | 0.5mm, 0.65mm (DNP, TI), 1.0mm (NLB, TI) |
Solderability | Hard to solder with a soldering iron due to underside thermal pad. |
Thermal Resistance | |
Dimensions | |
3D Models | |
Common Uses |
The [http://www.ti.com/packaging/docs/searchtipackages.tsp?packageName=SON](Texas Instruments Package Search - SON) page contains information on all of the USON
packages that TI components use.
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