SOT-583 Component Package

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Overview

A 3D render of the SOT-583 component package from Texas Instruments[^ti-tps628512-product-page].

A 3D render of the SOT-583 component package from Texas Instruments1.

SOT-583 is an 8-lead SMD component package.

Synonyms

  • FCSOT: Flipchip SOT, Texas Instruments
  • SOT-583-8: Monolithic Power Systems

Dimensions

SOT-583 has a pitch of 0.5mm. The package is 2.1mm x 1.6mm (including pins). The dimensions are shown in the image below.

The dimensions of the SOT-583 component package from TI. Image from https://www.ti.com/lit/ml/mpcs002/mpcs002.pdf.

The dimensions of the SOT-583 component package from TI. Image from https://www.ti.com/lit/ml/mpcs002/mpcs002.pdf.

The recommended footprint for the SOT-583 component package by TI. Image from https://www.ti.com/lit/ml/mpcs002/mpcs002.pdf.

The recommended footprint for the SOT-583 component package by TI. Image from https://www.ti.com/lit/ml/mpcs002/mpcs002.pdf.

Solderability

Hard but not impossible to solder by hand because of the small 0.5mm pitch. Reflow soldering is recommended.

Thermal Parameters

Junction-to-ambient thermal resistance\( R_{θJA} \)\( 110^\circ C \cdot W^{-1} \)
Junction-to-case (top) thermal resistance\( R_{θJC(top)} \)\( 41.3^\circ C \cdot W^{-1} \)
Junction-to-bottom (PCB) thermal resistance\( R_{θJB} \)\( 20^\circ C \cdot W^{-1} \)
Junction-to-top characterization parameter\( \Psi_{JT} \)\( 0.8^\circ C \cdot W^{-1} \)
Junction-to-bottom characterization parameter\( \psi_{JB} \)\( 20^\circ C \cdot W^{-1} \)

All thermal parameters from https://www.ti.com/lit/ds/symlink/tps628501-q1.pdf.

References


  1. Texas Instruments. TPS628512 - 2.7-V to 6-V, 2-A, fixed-frequency, step-down converter in SOT583 package. Retrieved 2024-04-19 from https://www.ti.com/product/TPS628512↩︎


Authors

Geoffrey Hunter

Dude making stuff.

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This work is licensed under a Creative Commons Attribution 4.0 International License .

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