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SOT-583 Component Package

Geoffrey Hunter
Geoffrey Hunter
mbedded.ninja Author

Overview​

A 3D render of the SOT-583 component package from Texas Instruments1.

SOT-583 is an 8-lead SMD component package.

Synonyms​

  • FCSOT: Flipchip SOT, Texas Instruments
  • SOT-583-8: Monolithic Power Systems

Dimensions​

SOT-583 has a pitch of 0.5mm. The package is 2.1mm x 1.6mm (including pins). The dimensions are shown in the image below.

The dimensions of the SOT-583 component package from TI. Image from https://www.ti.com/lit/ml/mpcs002/mpcs002.pdf.
The recommended footprint for the SOT-583 component package by TI. Image from https://www.ti.com/lit/ml/mpcs002/mpcs002.pdf.

Solderability​

Hard but not impossible to solder by hand because of the small 0.5mm pitch. Reflow soldering is recommended.

Thermal Parameters​

Junction-to-ambient thermal resistanceRθJAR_{θJA}110∘C⋅W−1110^\circ C \cdot W^{-1}
Junction-to-case (top) thermal resistanceRθJC(top)R_{θJC(top)}41.3∘C⋅W−141.3^\circ C \cdot W^{-1}
Junction-to-bottom (PCB) thermal resistanceRθJBR_{θJB}20∘C⋅W−120^\circ C \cdot W^{-1}
Junction-to-top characterization parameterΨJT\Psi_{JT}0.8∘C⋅W−10.8^\circ C \cdot W^{-1}
Junction-to-bottom characterization parameterψJB\psi_{JB}20∘C⋅W−120^\circ C \cdot W^{-1}

All thermal parameters from https://www.ti.com/lit/ds/symlink/tps628501-q1.pdf.

Footnotes​

  1. Texas Instruments. TPS628512 - 2.7-V to 6-V, 2-A, fixed-frequency, step-down converter in SOT583 package. Retrieved 2024-04-19 from https://www.ti.com/product/TPS628512. ↩