SOT-583 Component Package
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Overview
![A 3D render of the SOT-583 component package from Texas Instruments[^ti-tps628512-product-page].](https://blog.mbedded.ninja/pcb-design/component-packages/sot-583-component-package/_assets/sot-583-component-package-3d-render-ti.png)
A 3D render of the SOT-583 component package from Texas Instruments1.
SOT-583 is an 8-lead SMD component package.
Synonyms
- FCSOT: Flipchip SOT, Texas Instruments
- SOT-583-8: Monolithic Power Systems
Dimensions
SOT-583 has a pitch of 0.5mm. The package is 2.1mm x 1.6mm (including pins). The dimensions are shown in the image below.
The dimensions of the SOT-583 component package from TI. Image from https://www.ti.com/lit/ml/mpcs002/mpcs002.pdf.
Recommended Footprint
The recommended footprint for the SOT-583 component package by TI. Image from https://www.ti.com/lit/ml/mpcs002/mpcs002.pdf.
Solderability
Hard but not impossible to solder by hand because of the small 0.5mm pitch. Reflow soldering is recommended.
Thermal Parameters
| Junction-to-ambient thermal resistance | \( R_{θJA} \) | \( 110^\circ C \cdot W^{-1} \) |
| Junction-to-case (top) thermal resistance | \( R_{θJC(top)} \) | \( 41.3^\circ C \cdot W^{-1} \) |
| Junction-to-bottom (PCB) thermal resistance | \( R_{θJB} \) | \( 20^\circ C \cdot W^{-1} \) |
| Junction-to-top characterization parameter | \( \Psi_{JT} \) | \( 0.8^\circ C \cdot W^{-1} \) |
| Junction-to-bottom characterization parameter | \( \psi_{JB} \) | \( 20^\circ C \cdot W^{-1} \) |
All thermal parameters from https://www.ti.com/lit/ds/symlink/tps628501-q1.pdf.
References
Texas Instruments. TPS628512 - 2.7-V to 6-V, 2-A, fixed-frequency, step-down converter in SOT583 package. Retrieved 2024-04-19 from https://www.ti.com/product/TPS628512. ↩︎
Authors
This work is licensed under a Creative Commons Attribution 4.0 International License .
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