TO-268 (D3PAK) Component Package

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Date Published:	April 7, 2015
Last Modified:	April 8, 2024

Overview

Photo of the D3PAK (TO-268) component package.

The TO-268 (Transistor Outline 268, commonly known as D3PAK) is a SMD component package. It is the third in the series of “DPAK” packages, the first being TO-252 (DPAK) and the second being TO-263 (D2PAK). The D3PAK name stands for “decawatt 3 package” and has the highest power dissipation rating out of the three. Unlike the TO-263 package, the TO-268 package only comes in one variant with 3 pins (as far as I can tell). This variant can be referred to as TO-268-3.

It is designed to have a really low thermal resistance so that it can be used in high power applications. The larger die also means that MOSFETs in this package can have lower \(R_{DS(ON)}\) values, resulting in less power dissipation for the same current.

I have only ever seen this in the 3-pin variant (called TO-268-3). Common uses include Microsemi power MOSFETs, Microsemi power diodes, and Microsemi power IGBTs.

Synonyms

TO-268 (Transistor Outline 268)
D3PAK
DDDPAK
Decawatt Package 3
TO-268AA (TO-268-3)

Package Dimensions

Shown below are the package dimensions.

Dimensions for the D3PAK (TO-268) component package.

Thermal Resistances

\(T_{JC}: 0.24-1.18^{\circ}{\rm C}/W\)
\(T_{JA}: 40^{\circ}{\rm C}/W\)
\(T_{JA}: 21.9^{\circ}{\rm C}/W\) (13.5x17.5mm copper pad)
\(T_{JA}: 18^{\circ}{\rm C}/W\) (19x29.4mm copper pad)

Solderability

Easy to solder by hand, as long as you have a decent powered soldering iron for the central thermal pad. Easy to solder with infrared and reflow techniques.