LGA Component Package

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NameLand Grid Array
  • LGA 771 - Intel Socket J
  • LGA 775 - Intel Socket T
  • LGA 1150 - Intel Socket H3
  • LGA 1155 - Intel Socket H2
  • LGA 1156 - Intel Socket H
  • LGA 1207 - AMD Socket F, AMD Socket C32
  • LGA 1356 - Intel Socket B2
  • LGA 1366 - Intel Socket B
  • LGA 1944 - AMD Socket G34
  • LGA 2011 - Intel Socket R
Similar To
  • BGA
  • PGA
Pin CountApprox 5-2000.
SolderabilityCannot solder with a soldering iron, soldering with hot air or infrared is o.k., recommended practise is to use reflow techniques.
Thermal Resistancen/a
Land Arean/a
3D Modelsn/a
Common Uses
  • CPU's
  • Cellular modems
  • Other modules


The LGA package comes in many different variants, all which have a different number of pins and a different pin configuration. The pins are normally lines up in a grid of x columns and y rows, but not every position may have a pad. Therefore you can get variants with the same LGA package width and length.

Like BGAs, LGA packages can withstand up to 50% mis-alignment when soldering, as the package will automatically align itself. LGA packages can be connected to the PCB either with a socket or direct soldering. Intel has popularised the package by using it on some of it’s CPU families.

3D Renders

A 3D render of the LGA component package.

A 3D render of the LGA component package.


Socket for the LGA-775 component package.

Socket for the LGA-775 component package.



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