COMPONENT PACKAGES

Mini-DIP SPM

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Overview

Name Mini Dual In-Line Package
Synonyms
  • SPM27-JA
  • SPM27-CC
  • SPM27-EC
Variants n/a
Similar To DIP
Mounting TH
Pin Count 27
Pitch 1.778mm, 2.050mm, 2.531mm (3 different pitches on the one package!)
Solderability Easy to solder by hand.
Thermal Resistance n/a
Land Area Mini-DIP SPM 27 : 44mm x 26.8mm = 1179.2mm^2
Height 3.15mm (when mounted)
3D Models n/a
Common Uses BLDC motor drivers from Fairchild

Comments

The SPM27-JA does not have a top-side copper face, while the SPM27-CC and SPM27-EC do. The copper face has been designed specifically for heatsinking as these ICs are designed to be able to handle plenty of power. This package is rather unique in the fact it contains a three-phase IGBT inverter circuit power block and four drive ICs. As of 2012, only a 27-pin variant exists.

3D Renders

A 3D render of the Mini-DIP SPM component package.

A 3D render of the Mini-DIP SPM component package.


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