Mini-DIP SPM

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Date Published:	April 5, 2015
Last Modified:	April 5, 2015

Overview

Name	Mini Dual In-Line Package
Synonyms	SPM27-JA SPM27-CC SPM27-EC
Variants	n/a
Similar To	[DIP](../dip-component-package)
Mounting	TH
Pin Count	27
Pitch	1.778mm, 2.050mm, 2.531mm (3 different pitches on the one package!)
Solderability	Easy to solder by hand.
Thermal Resistance	n/a
Land Area	Mini-DIP SPM 27 : 44mm x 26.8mm = 1179.2mm^2
Height	3.15mm (when mounted)
3D Models	n/a
Common Uses	BLDC motor drivers from Fairchild

Comments

The SPM27-JA does not have a top-side copper face, while the SPM27-CC and SPM27-EC do. The copper face has been designed specifically for heatsinking as these ICs are designed to be able to handle plenty of power. This package is rather unique in the fact it contains a three-phase IGBT inverter circuit power block and four drive ICs. As of 2012, only a 27-pin variant exists.