COMPONENT PACKAGES
WSON Component Package
| Date Published: | |
| Last Modified: |
Overview
| Name | WSON (Small-outline No-lead Package) |
| Synonyms | |
| Variants | Varying number of pins. |
| Similar To | SOIC |
| Mounting | SMD |
| Pin Count | 8 (all also have exposed thermal pad) |
| Pitch | 1.27mm (just like SOIC), except for Texas Instrument's WSON |
| Solderability | Hard to solder with a soldering iron due to underside thermal pad. |
| Thermal Resistance | |
| Dimensions | WSON-8
|
| 3D Models | |
| Common Uses |
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Comments
The WSON package has a exposed thermal pad on the underside. However, it is not normally electrically connected to anything, and is optionally soldered to the PCB. It is recommended to be soldered when the PCB has a large amount of flex, else left unconnected.
Below is an “odd shaped” SON package used by Numonyx flash chips that goes under the name VDFPN8. Notice the half-round appearance of the pins.
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