WSON COMPONENT PACKAGE

WSON Component Package

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Date Published:	January 21, 2015
Last Modified:	April 5, 2022

1. Overview

Name

WSON (Plastic Small-outline No-lead Package)

Image

Synonyms

DMB/PWSON (Texas Instruments)[2]
DQD (Texas Instruments)

Similar To

Variants

Varying number of pins, 8 is common.

Mounting

SMD

Pin Count

8 (all also have exposed thermal pad)

Pitch

Varies. Many are 1.27mm (just like SOIC, for example the Cypress WSON 8L package), the TI DMB package as a pitch of 1.0mm, and the TI DQD package as a pitch of 0.4mm.

Solderability

Reflow is most suitable. Hard to solder with a soldering iron due to underside thermal pad.

Thermal Resistance

Package Dimensions

Typical PCB Land Area

3D Models

Common Uses

Flash memory ICs
Secondary-side bias regulators for DC-DC converters

2. Comments

The WSON package has a exposed thermal pad on the underside. However, it is not normally electrically connected to anything, and is optionally soldered to the PCB. It is recommended to be soldered when the PCB has a large amount of flex, else left unconnected.

Figure 1. A 3D render of the WSON-8 (PG-WSON-8-1) component package from Infineon[1].

Texas Instruments has a WSON package which does not have a pitch of 1.27mm!

Below is an "odd shaped" SON package used by Numonyx flash chips that goes under the name VDFPN8. Notice the half-round appearance of the pins.

component package vdfpn8 mlp8 outline dimensions

Figure 2. Outline and dimensions for the VDFPN8 (SON-8) component package of a Numonyx flash IC. Image from http://www.micron.com/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/Serial%20NOR/M25P/M25P128.pdf.

Atmel produces a document titled PCB Design Considerations when Changing from 6-pin SOT23 to 6-pin WSON Atmel Products. It is a good read if you are migrating from larger SOT-23 packages to the smaller WSON package.

3. The DMB/PWSON Package (Texas Instruments)

The DMB package (also called PWSON) is a variant of the WSON package used by Texas Instruments[2]. It has a pitch of 1mm. The HDC1080 datasheet is an example of a TI component which comes in the DMB package.

4. R-PWSON/DQD Package (Texas Instruments)

The R-PWSON/DQD package is a variant of the WSON package used by Texas Instruments. The TPD8F003 datasheet is an example of a TI component which comes in the DQD package. There seems to be a number of different packages using the DQD code, these include:

R-PWSON-N12 (12 leads)[3]
R-PWSON-N16 (16 leads)[3]

dqd texas instruments tpd8f003 wson component package

Figure 3. The pin diagram for three different TPD8F003 family components which come in the WSON style package[3].

3D models exist for some of the DQD packages on 3DContentCentral, for example:

References

[1] Infineon. Packages > PG-WSON >PG-WSON-8-1. Retrieved 2022-04-05, from https://www.infineon.com/cms/en/product/packages/PG-WSON/PG-WSON-8-1/.
[2] Texas Instruments (2016, Jan). HDC1080: Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor (datasheet). Retrieved 2022-04-05, from https://www.ti.com/lit/ds/symlink/hdc1080.pdf.
[3] Texas Instruments (2014, Aug). TPDxF003: Four-, Six-, and Eight-Channel EMI Filters With Integrated ESD Protection (datasheet). Retrieved 2022-04-05, from https://www.ti.com/lit/ds/symlink/tpd8f003.pdf.

Authors

Geoffrey Hunter

Dude making stuff.

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This work is licensed under a Creative Commons Attribution 4.0 International License .