WSON (Plastic Small-outline No-lead Package)
Varying number of pins, 8 is common.
8 (all also have exposed thermal pad)
Varies. Many are 1.27mm (just like SOIC, for example the Cypress WSON 8L package), the TI DMB package as a pitch of 1.0mm, and the TI DQD package as a pitch of 0.4mm.
Reflow is most suitable. Hard to solder with a soldering iron due to underside thermal pad.
Typical PCB Land Area
The WSON package has a exposed thermal pad on the underside. However, it is not normally electrically connected to anything, and is optionally soldered to the PCB. It is recommended to be soldered when the PCB has a large amount of flex, else left unconnected.
|Texas Instruments has a WSON package which does not have a pitch of 1.27mm!|
Below is an "odd shaped" SON package used by Numonyx flash chips that goes under the name VDFPN8. Notice the half-round appearance of the pins.
Atmel produces a document titled PCB Design Considerations when Changing from 6-pin SOT23 to 6-pin WSON Atmel Products. It is a good read if you are migrating from larger SOT-23 packages to the smaller WSON package.
3. The DMB/PWSON Package (Texas Instruments)
4. R-PWSON/DQD Package (Texas Instruments)
DQD package is a variant of the
WSON package used by Texas Instruments. The TPD8F003 datasheet is an example of a TI component which comes in the
DQD package. There seems to be a number of different packages using the
DQD code, these include:
3D models exist for some of the DQD packages on 3DContentCentral, for example:
 Infineon. Packages > PG-WSON >PG-WSON-8-1. Retrieved 2022-04-05, from https://www.infineon.com/cms/en/product/packages/PG-WSON/PG-WSON-8-1/.
 Texas Instruments (2016, Jan). HDC1080: Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor (datasheet). Retrieved 2022-04-05, from https://www.ti.com/lit/ds/symlink/hdc1080.pdf.
 Texas Instruments (2014, Aug). TPDxF003: Four-, Six-, and Eight-Channel EMI Filters With Integrated ESD Protection (datasheet). Retrieved 2022-04-05, from https://www.ti.com/lit/ds/symlink/tpd8f003.pdf.
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