COMPONENT PACKAGES

WSON Component Package

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Date Published:	January 21, 2015
Last Modified:	March 4, 2020

Overview

Name	WSON (Plastic Small-outline No-lead Package)
Synonyms	DMB/PWSON (Texas Instruments) DQD (Texas Instruments)
Variants	Varying number of pins.
Similar To	SOIC	USON
Mounting	SMD
Pin Count	8 (all also have exposed thermal pad)
Pitch	Varies. Many are 1.27mm (just like SOIC, for example the Cypress WSON 8L package), the TI DMB package as a pitch of 1.0mm, and the TI DQD package as a pitch of 0.4mm.
Solderability	Hard to solder with a soldering iron due to underside thermal pad.
Thermal Resistance
Dimensions	WSON-8 Package: 6.0x5.0x0.80mm (wlh, Winbond package code ZP) Recommended Land Pattern: 6.10x5.10mm (31.11mm2)
3D Models	WSON-8 6x8mm WSON-10 3x3mm
Common Uses	Flash memory ICs Secondary-side bias regulators for DC-DC converters

Comments

The WSON package has a exposed thermal pad on the underside. However, it is not normally electrically connected to anything, and is optionally soldered to the PCB. It is recommended to be soldered when the PCB has a large amount of flex, else left unconnected.

Below is an “odd shaped” SON package used by Numonyx flash chips that goes under the name VDFPN8. Notice the half-round appearance of the pins.

Outline and dimensions for the VDFPN8 (SON-8) component package of a Numonyx flash IC.Image from http://www.micron.com/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/Serial%20NOR/M25P/M25P128.pdf.

Atmel produces a document titled PCB Design Considerations when Changing from 6-pin SOT23 to 6-pin WSON Atmel Products. It is a good read if you are migrating from larger SOT-23 packages to the smaller WSON package.

The DMB/PWSON Package (Texas Instruments)

The DMB package (also called PWSON) is a variant of the WSON package used by Texas Instruments. It has a pitch of 1mm. The HDC1080 datasheet is an example of a TI component which comes in the DMB package.

The DQD Package (Texas Instruments)

The DQD package is a variant of the WSON package used by Texas Instruments. The TPD8F003 datasheet is an example of a TI component which comes in the DQD package.

The pin diagram for three different TPD8F003 family components which come in the WSON package (the TI synonym for WSON is DQD).

3D model exist for some of the DQD packages on 3DContentCentral, for example:

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