COMPONENT PACKAGES

WSON Component Package

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Overview

NameWSON (Small-outline No-lead Package)
Synonyms 
VariantsVarying number of pins.
Similar ToSOIC
MountingSMD
Pin Count8 (all also have exposed thermal pad)
Pitch1.27mm (just like SOIC), except for Texas Instrument's WSON
SolderabilityHard to solder with a soldering iron due to underside thermal pad.
Thermal Resistance 
Dimensions

WSON-8

  • Package: 6.0x5.0x0.80mm (wlh, Winbond package code ZP)
  • Recommended Land Pattern: 6.10x5.10mm (31.11mm2)
3D Models 
Common Uses
  • Flash memory ICs
  • Secondary-side bias regulators for DC-DC converters

Comments

The WSON package has a exposed thermal pad on the underside. However, it is not normally electrically connected to anything, and is optionally soldered to the PCB. It is recommended to be soldered when the PCB has a large amount of flex, else left unconnected.

Below is an “odd shaped” SON package used by Numonyx flash chips that goes under the name VDFPN8. Notice the half-round appearance of the pins.

Outline and dimensions for the VDFPN8 (SON-8) component package of a Numonyx flash IC.Image from http://www.micron.com/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/Serial%20NOR/M25P/M25P128.pdf.

Outline and dimensions for the VDFPN8 (SON-8) component package of a Numonyx flash IC.Image from http://www.micron.com/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/Serial%20NOR/M25P/M25P128.pdf.


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