HU3PAK Component Package

Contents

Overview

Name	HU3PAK
Image
Synonyms	None
Variants	None
Similar To	n/a
Mounting	SMD
Pin Count	7 + tab (which has two PCB contact points)
Pitch	1.27mm 1
Solderability	Easy to hand-solder if you have had a bit of practise with surface mount devices before. Easy to solder with infrared or reflow techniques.
Thermal Resistance	\(R_{JC} = 0.51^{\circ}C/W\) 2 \(R_{JA} = 30^{\circ}C/W\) 2 (when mounted on 2oz. 1inch^2 PCB) (note that this thermal resistance hides the fact that the thermal resistance to ambient can be much lower if a top-side heatsink is added as intended)
Dimensions	14mm wide, 18.58 long (including leads) and 3.50mm high 1
3D Models	n/a
Common Uses	MOSFETs 2

The HU3PAK component package is a package design used solely by ST Microelectronics. It’s designed attached to a heatsink on it’s top surface, but unusually does not have any provision for thermally coupling to the PCB (the recommended footprint only has a small amount of soldering points for the 7 pins and two tab locations).

The only use I could find for this package is for MOSFETs.

References