HU3PAK COMPONENT PACKAGE
HU3PAK Component Package
|Pin Count||7 + tab (which has two PCB contact points)|
|Solderability||Easy to hand-solder if you have had a bit of practise with surface mount devices before. Easy to solder with infrared or reflow techniques.|
|Dimensions||14mm wide, 18.58 long (including leads) and 3.50mm high|
HU3PAK component package is a package design used solely by ST Microelectronics. It’s designed attached to a heatsink on it’s top surface, but unusually does not have any provision for thermally coupling to the PCB (the recommended footprint only has a small amount of soldering points for the 7 pins and two tab locations).
The only use I could find for this package is for MOSFETs.
ST Microelectronics (2021, Nov). TN1378: HU3PAK package mounting and thermal behavior. Retrieved 2022-11-07, from https://www.st.com/resource/en/technical_note/tn1378-hu3pak-package-mounting-and-thermal-behavior-stmicroelectronics.pdf. ↩︎ ↩︎
ST Microelectronics (2021, Nov). STHU32N65DM6AG: Automotive-grade N-channel 650 V, 83 mΩ typ., 37 A MDmesh DM6 Power MOSFET in an HU3PAK package (datasheet). Retrieved 2022-11-07, from https://www.st.com/resource/en/datasheet/sthu32n65dm6ag.pdf. ↩︎ ↩︎ ↩︎ ↩︎
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