USIP COMPONENT PACKAGE

# uSiP Component Package

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## Overview

 Name uSiP (Plastic System In Package or Micro System In Package, TI) Synonyms SIL (TI) Variants SIL-10C (10 pin uSiP) Similar To Mounting SMD Pin Count 8-33 Pitch Solderability Thermal Resistance Depends on variant and exact component, see the Thermal Resistance section below. Dimensions 3D Models Common Uses Small point-of-load power modules.

The uSiP package is used for the TPSM265R1 family of point-of-load power modules (this component incorporates the SMPS buck controller, MOSFET, inductor and some of the capacitors, hence being a complete power modules).

## Thermal Resistance

The thermal resistance of a uSiC package depends on the variant and also on the components soldered onto the sub-assembly. For that reason, thermal resistances are not given per package, but per component in the component’s datasheet. For example, a graph of $$\theta_{JA}$$ versus copper area on the PCB is shown below from the TPSM265R1 datasheet, which uses the SIL-10C uSiP package: