USIP COMPONENT PACKAGE

uSiP Component Package

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Overview

NameuSiP (Plastic System In Package or Micro System In Package, TI)
Synonyms
  • SIL (TI)
Variants
  • SIL-10C (10 pin uSiP)
Similar To
MountingSMD
Pin Count8-33
Pitch
Solderability
Thermal ResistanceDepends on variant and exact component, see the Thermal Resistance section below.
Dimensions
3D Models
    Common Uses
    • Small point-of-load power modules.

    The uSiP package is used for the TPSM265R1 family of point-of-load power modules (this component incorporates the SMPS buck controller, MOSFET, inductor and some of the capacitors, hence being a complete power modules).

    A 3D render of the SIL-10C 10-pin uSiP component package. Image from https://www.ti.com/lit/ds/symlink/tpsm265r1.pdf, retrieved 2021-03-03.

    A 3D render of the SIL-10C 10-pin uSiP component package. Image from https://www.ti.com/lit/ds/symlink/tpsm265r1.pdf, retrieved 2021-03-03.

    Thermal Resistance

    The thermal resistance of a uSiC package depends on the variant and also on the components soldered onto the sub-assembly. For that reason, thermal resistances are not given per package, but per component in the component’s datasheet. For example, a graph of \(\theta_{JA}\) versus copper area on the PCB is shown below from the TPSM265R1 datasheet, which uses the SIL-10C uSiP package:

    Theta JA vs. copper area for the TPSM265R1 power module in the SIL-10C uSiP component package.

    Theta JA vs. copper area for the TPSM265R1 power module in the SIL-10C uSiP component package.


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