USIP COMPONENT PACKAGE

uSiP Component Package

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Contents

1. Overview

Name

uSiP (Plastic System In Package or Micro System In Package, TI)

Synonyms

  • MicroSiP

  • SIL (TI)

Variants

  • SIL0010A (uSIP-10, 3.8x3.0mm)

  • SIL0010C (uSIP-10, 3.7x2.8mm)

Similar To

n/a

Mounting

SMD

Pin Count

8-33

Pitch

Depends on variant (see below).

Solderability

Reflow is required.

Thermal Resistance

Depends on variant and exact component, see the Thermal Resistance section below.

Package LxWxH

Depends on variant.

Typical PCB Land Area

3D Models

n/a

Common Uses

  • Small point-of-load power modules.

The uSiP package is a system-in-package design used for switch-mode power supplies (SMPS). It is proprietary to Texas Instruments. It uses a PCB base with an embedded SMPS controller IC, connected to an inductor (and optionally, capacitors) mounted to the top surface of the PCB base. Leads are provided as an LGA on the bottom side of the PCB base. All up, this makes a single discrete SMD component that can take part in the reflow process onto a normal PCB design.

The uSiP package is used for the TPSM265R1 family of point-of-load power modules (this component incorporates the SMPS buck controller, MOSFET, inductor and some of the capacitors, hence being a complete power modules). It appears there are SIL0010A and SIL0010C variants (same number of pins, but slightly different pitch and package size), but no SIL0010B.

sil10c usip component package 3d render
Figure 1. A 3D render of the SIL-10C 10-pin uSiP component package[1]. Image © 2019 Texas Instruments.

Manufacturing and Rework Design Guide for MicroSiP Power Modules has some good advice regarding manufacturing and reworkability of the uSiP (MicroSiP) package.

2. SIL0008D (uSIP-8, 3.0x2.8mm)

Pitch

0.65mm[3]

Package WxLxH

3.0x2.8x1.53mm[3]

Typical Land Area

6.11mm² (2.6*2.35mm)[3]

SIL0008D is a 8-pin, 3.0x2.8mm package size variant of the uSIP. Used by the TPS82130S buck converter module by Texas Instruments.

3. SIL0010A (uSIP-10, 3.8x3.0mm)

Pitch

0.6mm[2]

Package WxLxH

3.8x3.0x1.6mm[2]

Typical Land Area

10.73mm² (3.7*2.9mm)[2]

SIL0010A is a 10pin, 3.8x3.0mm package size variant of the uSIP.

4. SIL0010C (uSIP-10, 3.7x2.8mm)

Pitch

0.80mm[1]

Package WxLxH

3.7x2.8x1.8mm[1]

Typical Land Area

13.86mm² (3.3*4.2mm)[1]

SIL0010C is a 10pin, 3.7x2.8mm package size variant of the uSIP.

Figure 2 shows \(\theta_{JA}\) versus copper area on the PCB for the SIL-10C uSiP package.

tpsm265r1 theta ja vs copper area
Figure 2. \(\theta_ja\) vs. copper area for the TPSM265R1 power module in the SIL-10C uSiP component package[1].

References

Authors

Geoffrey Hunter

Dude making stuff.

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This work is licensed under a Creative Commons Attribution 4.0 International License .

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