TO-247 COMPONENT PACKAGE
TO-247 Component Package
Date Published: | |
Last Modified: |
Contents
1. Overview
Name | TO-247 (Transistor Outline 247, JEDEC) |
Synonyms |
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Similar To |
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Variants | |
Mounting | TH |
Pin Count | 2, 3 (TO-247AC) |
Pitch | 5.45mm (0.215")[1] |
Solderability | Suitable for wave soldering. Easy to solder by hand. |
Thermal Resistance | |
Package LxWxH | n/a |
Typical PCB Land Area | n/a |
3D Models | n/a |
Common Uses |
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2. TO-247AC (TO-247-3)
The TO-247AC
(a.k.a. TO-247-3
) is the 3-pin variant of the TO-247 package. It is considered the "upgrade" of the TO-218 (SOT-93), with the main difference being the insulated mounting hole, making it easier to mount to a heatsink without shorting things out (it is "mechanically compatible" with the TO-218, however not identical![1]).
When containing a MOSFET, the pin wiring is usually:
Gate
Drain
Source



3. TO-247PLUS
The TO-247PLUS
packages (TO-247PLUS-3 and TO-247PLUS-4) are variants of the TO-247 package by Infineon. The main difference is the removal of the mounting holes in the TO-247PLUS variants, plus some extended creepage distances for the TO-247PLUS[2].

References
[1] ON Semiconductor (2012, Jun 9). Final Product/Process Change Notification #16827: Package change from TO-218 to TO-247 for all Bipolar Power Transistors. Retrieved 2021-12-24, from https://www.mouser.com/PCN/ON%20Semiconductor_16827.pdf.
[2] Infineon (2017, Feb 10). AN2017-01: TO-247PLUS - Description of the packages and assembly guidelines. Retrieved 2021-12-25, from https://www.infineon.com/dgdl/Infineon-Discrete_IGBT_in_TO-247PLUS-AN-v02_00-EN.pdf?fileId=5546d46249cd10140149e0c7fe9d56c7.
Authors

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