TO-263 COMPONENT PACKAGE

TO-263 Component Package

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Date Published:	April 7, 2015
Last Modified:	December 15, 2021

1. Overview

Name

Transistor Outline 263 (JEDEC)

Synonyms

D2PAK (Double Decawatt package)
DDPAK (Double Decawatt package)
SMD-220 (named so because the TO-263 is the SMD equivalent of the TO-220).
TO-263 (Transistor Outline 263, JEDEC)
TO-263AB (TO-263-3S only)
TO-279 (TO-263 THIN only, by Texas Instruments)

Similar To

TO-220

Variants

TO-263-X1X2 (where X1 is the lead count and X2 is the length of the centre pin).
TO-263 THIN (a thinner variant of the standard TO-263 package by Texas Instruments).

Mounting

SMD

Pin Count

Depends on variant.

3, 5, 7, or 9 (this is X1). All packages also have a thermal pad.

Pitch

Depends on variant.

TO-263-3, TO-263-3S: 2.54mm
TO-263-7, TO-263-7S: 1.7mm

Solderability

Easy to solder by hand, as long as you have a decent powered soldering iron for the central thermal pad. Easy to solder with infrared and reflow techniques.

Thermal Resistance

Package LxWxH

Height:

All except TO-263 THIN: 4.57mm
TO-263 THIN: 2.00mm

Typical PCB Land Area

3D Models

See the variant information below.

Common Uses

High power MOSFETs
High power LDOs
High power SMPS (usually with integrated switching element)

2. The Standard Package (TO-263)

The TO-263 package can be considered the SMD version of the TO-220AB package. It is a 3, 5 or 7 leaded heavy-duty SMD package that allows for good heat-sinking due to a large pad on it’s underside. It is used frequently for high power MOSFETs, LDOs and SMPS. Comes with either a normal middle lead (X2 = nothing) or a short, cut-off middle lead (X2 = S).

d2pak to 263 component package 3d render

Figure 1. A 3D render of the TO-263 (D2PAK) component package.

3. TO-263-3

The TO-263-3 is the 3-pin variant of the TO-263.

The junction-to-ambient thermal resistance for the TO-263-3 component package on both standard JEDEC 2-layer and 4-layer boards is shown below:

d2pak to 263 component package thermal resistance 2 vs 4 layer comparison

Figure 2. Junction-to-ambient thermal resistance data of the TO-263 component package on both standard JEDEC 2-layer and 4-layer PCBs. Image from www.ti.com.

\(T_{JA} = 18.0^{\circ}{\rm C}/W\) (1 square inch of copper surrounding pads, connected to ground)
\(T_{JA} = 33.6^{\circ}{\rm C}/W\) (copper filling package land-area)
\(T_{JA} = 36.7^{\circ}{\rm C}/W\) (pads only, no copper fill)

3D models:

4. TO-263-5

The TO-263-5 is the 5-pin variant of the TO-263.

Thermal resistance of the TO-263-5L THIN:

\(T_{JA} = 22.0^{\circ}{\rm C}/W\) (no air flow, on JEDEC 4-layer test board)

3D models:

5. TO-263-7

The TO-263-7 is the 7-pin variant of the TO-263.

3D models:

TO-263-7S

6. TO-263 THIN

TO-263 THIN is a variant of the TO-263 component package by Texas Instruments. It shares a similar PCB footprint, but is significantly smaller in height (i.e. thinner).