SOD-523 COMPONENT PACKAGE
SOD-523 Component Package
Date Published: | |
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Contents
1. Overview
Name | SOD-523 (Small Outline Diode 523) (JEDEC) |
Image | |
Synonyms | |
Similar To | |
Variants | None |
Mounting | SMD |
Pin Count | 2 |
Pitch | 1.40mm |
Solderability | Reflow is most suitable. Possible to hand solder/reflow as long as experienced. |
Thermal Resistance | |
Package Dimensions | |
Typical PCB Land Area | \(2.58mm^2\) (2.15x1.20mm)[2] |
3D Models | * |
Common Uses |
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2. Comments
The SOD-523 package size (excluding height) of 1.65x0.80mm (length x width) is very similar to the 0603 chip package size of (1.55x0.85mm). SOD-523 is smaller than the SOD-323 package, but larger than the SOD-723 package.
References
[1] ON Semiconductor (now onsemi). RB751S40: Schottky Barrier Diode (datasheet). Retrieved 2022-03-24, from https://www.onsemi.cn/pdf/datasheet/rb751s40t1-d.pdf.
[2] NXP (2022). SOD523 plastic surface-mounted package; 2 leads (package information). Retrieved 2022-03-24, from https://www.nxp.com/docs/en/package-information/SOD523.pdf.
[3] Panasonic (2013, Apr). DB2S308 (datasheet). Retrieved 2022-03-24, from https://docs.rs-online.com/4e91/0900766b814af80d.pdf.
[4] Nexperia. SC-79 (SOD523) plastic, surface-mounted package; 2 leads; 1.2 mm x 0.8 mm x 0.6 mm body. Retrieved 2022-03-24, from https://www.nexperia.com/packages/SOD523.html.
Authors

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