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TSSOP Component Package

Geoffrey Hunter Author


TSSOP (Thin Shrink Small Outline Package) is a plastic, SMD IC component package with gull-wing leads.


  • PWP (PowerPAD) (TI's name for the HTSSOP variant, independent on pin count)1
  • SOT1171-2 (NXP's name for the HTSSOP-28)2
  • MO-153 (JEDEC's name for the HTSSOP-28)2

Pin Count: 8-803


  • 0.50mm3
  • 0.65mm

Solderability: Reflow is most suitable. O.K. to solder by hand by an experienced user. Care must be taken to avoid solder bridges between the legs of the IC.

Common Uses:

  • General ICs
  • H-bridges (the HTSSOP variant)


A 3D render of the TSSOP-38 component package.

Body widths of TSSOP packages can be 3.0, 4.4 and 6.1mm3.


HTSSOP is a variant of the TSSOP with a solder pad on the underside, used by both Texas Instruments and Rohm Semiconductor4 5. It is used for ICs which require good thermal conductivity (e.g. half-bridges, SMPS).

  • RθJAR_{\theta JA}: Junction-to-ambient thermal resistance.
  • RθJBR_{\theta JB}: Junction-to-board thermal resistance.
  • RθJC(top)R_{\theta JC(top)}: Junction-to-case (top) thermal resistance.
  • RθJC(bot)R_{\theta JC(bot)}: Junction-to-case (bottom) thermal resistance.
Package NameBody Size (nominal)RθJAR_{\theta JA}RθJBR_{\theta JB}RθJC(top)R_{\theta JC(top)}RθJC(bot)R_{\theta JC(bot)}
HTSSOP-289.70x4.40mm131.0C/W31.0^{\circ}C/W110.8C/W10.8^{\circ}C/W125.2C/W25.2 ^{\circ}C/W13.3C/W3.3^{\circ}C/W1
A 3D render of the 28-pin TSSOP component package that has a thermal pad (HTSSOP-28).


  1. Texas Instruments (2020, May). DRV8424E/P, DRV8425E/P Dual H-Bridge Motor Drivers With Integrated Current Sense and Smart Tune Technology. Retrieved 2021-10-13, from 2 3 4 5 6

  2. NXP (2016, Feb 8). SOT1172-2 (Package Information). Retrieved 2021-10-13, from 2

  3. Wikipedia (2021, Jul). Thin shrink small outline package. Retrieved 2021-10-13, from 2 3

  4. Texas Instruments (2008, Jul). LM342x N -Channel Controllers for Constant-Current LED Drivers (Datasheet). Retrieved 2021-10-13, from 2 3 4 5 6 7 8 9 10 11

  5. Rohm Semiconductor (2016, Sep 19). Package Information : HTSSOP-B28. Retrieved 2021-10-13, from