TSSOP COMPONENT PACKAGE

TSSOP Component Package

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1. Overview

Name

TSSOP (Thin Scale Small Outline Package)

Synonyms

  • PWP (PowerPAD) (TI’s name for the HTSSOP variant, independent on pin count)[3]

  • SOT1171-2 (NXP’s name for the HTSSOP-28)[2]

  • MO-153 (JEDEC’s name for the HTSSOP-28)[2]

Similar To

n/a

Mounting

SMD

Pin Count

8-80[4]

Pitch

  • 0.50mm[4]

  • 0.65mm

Solderability

Reflow is most suitable. O.K. to solder by hand by an experienced user. Care must be taken to avoid solder bridges between the legs of the IC.

Thermal Resistance

Package LxWxH

n/a

Typical PCB Land Area

3D Models

  • n/a

Common Uses

  • General ICs

  • H-bridges (the HTSSOP variant)

2. TSSOP

TSSOP (Thin Shrink Small Outline Package) is a plastic, SMD IC component package with gull-wing leads.

tssop 38 component package 3d render
Figure 1. A 3D render of the TSSOP-38 component package.

Body widths of TSSOP packages can be 3.0, 4.4 and 6.1mm[4].

3. HTSSOP

There is a variant of the TSSOP with a solder pad on the underside. Texas Instruments calls this the HTSSOP package[1] (Rohm Semiconductor also uses this name[5]). It is used for ICs which require good thermal conductivity (e.g. half-bridges, SMPS).

  • \(R_{\theta JA}\): Junction-to-ambient thermal resistance.

  • \(R_{\theta JB}\): Junction-to-board thermal resistance.

  • \(R_{\theta JC(top)}\): Junction-to-case (top) thermal resistance.

  • \(R_{\theta JC(bot)}\): Junction-to-case (bottom) thermal resistance.

Package NameBody Size (nominal)\(R_{\theta JA}\)\(R_{\theta JB}\)\(R_{\theta JC(top)}\)\(R_{\theta JC(bot)}\)

HTSSOP-16

5.00x4.40mm[1]

\(38.9^{\circ}C/W\)[1]

\(16.8^{\circ}C/W\)[1]

\(23.1^{\circ}C/W\)[1]

\(1.7^{\circ}C/W\)[1]

HTSSOP-20

6.50x4.40mm[1]

\(36.7^{\circ}C/W\)[1]

\(18^{\circ}C/W\)[1]

\(21.5^{\circ}C/W\)[1]

\(1.9^{\circ}C/W\)[1]

HTSSOP-28

9.70x4.40mm[3]

\(31.0^{\circ}C/W\)[3]

\(10.8^{\circ}C/W\)[3]

\(25.2 ^{\circ}C/W\)[3]

\(3.3^{\circ}C/W\)[3]

htssop 28 component package 3d render with thermal pad
Figure 2. A 3D render of the 28-pin TSSOP component package that has a thermal pad (HTSSOP-28).

References


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