TSSOP COMPONENT PACKAGE
TSSOP Component Package
Date Published: | |
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Contents
1. Overview
Name |
TSSOP (Thin Scale Small Outline Package) |
Synonyms |
Similar To |
n/a |
Mounting |
SMD |
Pin Count |
8-80[4] |
Pitch |
|
Solderability |
Reflow is most suitable. O.K. to solder by hand by an experienced user. Care must be taken to avoid solder bridges between the legs of the IC. |
Thermal Resistance |
Package LxWxH |
n/a |
Typical PCB Land Area |
3D Models |
|
Common Uses |
|
2. TSSOP
TSSOP (Thin Shrink Small Outline Package) is a plastic, SMD IC component package with gull-wing leads.

Body widths of TSSOP packages can be 3.0, 4.4 and 6.1mm[4].
3. HTSSOP
There is a variant of the TSSOP with a solder pad on the underside. Texas Instruments calls this the HTSSOP package[1] (Rohm Semiconductor also uses this name[5]). It is used for ICs which require good thermal conductivity (e.g. half-bridges, SMPS).
\(R_{\theta JA}\): Junction-to-ambient thermal resistance.
\(R_{\theta JB}\): Junction-to-board thermal resistance.
\(R_{\theta JC(top)}\): Junction-to-case (top) thermal resistance.
\(R_{\theta JC(bot)}\): Junction-to-case (bottom) thermal resistance.
Package Name | Body Size (nominal) | \(R_{\theta JA}\) | \(R_{\theta JB}\) | \(R_{\theta JC(top)}\) | \(R_{\theta JC(bot)}\) |
---|---|---|---|---|---|
HTSSOP-16 | 5.00x4.40mm[1] | \(38.9^{\circ}C/W\)[1] | \(16.8^{\circ}C/W\)[1] | \(23.1^{\circ}C/W\)[1] | \(1.7^{\circ}C/W\)[1] |
HTSSOP-20 | 6.50x4.40mm[1] | \(36.7^{\circ}C/W\)[1] | \(18^{\circ}C/W\)[1] | \(21.5^{\circ}C/W\)[1] | \(1.9^{\circ}C/W\)[1] |
HTSSOP-28 | 9.70x4.40mm[3] | \(31.0^{\circ}C/W\)[3] | \(10.8^{\circ}C/W\)[3] | \(25.2 ^{\circ}C/W\)[3] | \(3.3^{\circ}C/W\)[3] |

References
[1] Texas Instruments (2008, Jul). LM342x N -Channel Controllers for Constant-Current LED Drivers (Datasheet). Retrieved 2021-10-13, from https://www.ti.com/lit/ds/symlink/lm3421.pdf.
[2] NXP (2016, Feb 8). SOT1172-2 (Package Information). Retrieved 2021-10-13, from https://www.nxp.com/docs/en/package-information/SOT1172-2.pdf.
[3] Texas Instruments (2020, May). DRV8424E/P, DRV8425E/P Dual H-Bridge Motor Drivers With Integrated Current Sense and Smart Tune Technology. Retrieved 2021-10-13, from https://www.ti.com/lit/ds/symlink/drv8424e.pdf.
[4] Wikipedia (2021, Jul). Thin shrink small outline package. Retrieved 2021-10-13, from https://en.wikipedia.org/wiki/Thin_shrink_small_outline_package.
[5] Rohm Semiconductor (2016, Sep 19). Package Information : HTSSOP-B28. Retrieved 2021-10-13, from https://fscdn.rohm.com/en/techdata_basic/ic/package/htssop-b28_1-e.pdf.
Authors

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