TSSOP COMPONENT PACKAGE

TSSOP Component Package

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Date Published:	April 7, 2015
Last Modified:	June 13, 2023

Overview

TSSOP (Thin Shrink Small Outline Package) is a plastic, SMD IC component package with gull-wing leads.

Synonyms:

PWP (PowerPAD) (TI’s name for the HTSSOP variant, independent on pin count)¹
SOT1171-2 (NXP’s name for the HTSSOP-28)²
MO-153 (JEDEC’s name for the HTSSOP-28)²

Pin Count: 8-80³

Pitch:

0.50mm³
0.65mm

Solderability: Reflow is most suitable. O.K. to solder by hand by an experienced user. Care must be taken to avoid solder bridges between the legs of the IC.

Common Uses:

General ICs
H-bridges (the HTSSOP variant)

TSSOP

Body widths of TSSOP packages can be 3.0, 4.4 and 6.1mm³.

HTSSOP

HTSSOP is a variant of the TSSOP with a solder pad on the underside, used by both Texas Instruments and Rohm Semiconductor⁴ ⁵. It is used for ICs which require good thermal conductivity (e.g. half-bridges, SMPS).

\(R_{\theta JA}\): Junction-to-ambient thermal resistance.
\(R_{\theta JB}\): Junction-to-board thermal resistance.
\(R_{\theta JC(top)}\): Junction-to-case (top) thermal resistance.
\(R_{\theta JC(bot)}\): Junction-to-case (bottom) thermal resistance.

Package Name	Body Size (nominal)	`\(R_{\theta JA}\)`	`\(R_{\theta JB}\)`	`\(R_{\theta JC(top)}\)`	`\(R_{\theta JC(bot)}\)`
HTSSOP-16	5.00x4.40mm⁴	`\(38.9^{\circ}C/W\)`⁴	`\(16.8^{\circ}C/W\)`⁴	`\(23.1^{\circ}C/W\)`⁴	`\(1.7^{\circ}C/W\)`⁴
HTSSOP-20	6.50x4.40mm⁴	`\(36.7^{\circ}C/W\)`⁴	`\(18^{\circ}C/W\)`⁴	`\(21.5^{\circ}C/W\)`⁴	`\(1.9^{\circ}C/W\)`⁴
HTSSOP-28	9.70x4.40mm¹	`\(31.0^{\circ}C/W\)`¹	`\(10.8^{\circ}C/W\)`¹	`\(25.2 ^{\circ}C/W\)`¹	`\(3.3^{\circ}C/W\)`¹