COMPONENT PACKAGES

TSSOP Component Package

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Overview

NameTSSOP (Thin Scale Small Outline Package)
Synonymsn/a
Variants
  • Variant with pad on bottom for power ICs (e.g. half-bridges), known as HTSSOP.
Similar Ton/a
MountingSMD
Pin Countn/a
Pitchn/a
SolderabilityO.K. to solder by hand by experienced user. Care must be taken to avoid solder bridges between the legs of the IC.
Thermal Resistancen/a
Land Arean/a
Heightn/a
3D Modelsn/a
Common Uses
  • General IC's
  • H-bridges (the HTSSOP variant)

Variants

There is a variant of the TSSOP with a solder pad on the underside. Texas Instruments calls this the HTSSOP package. It is used for ICs which require good thermal conductivity (e.g. half-bridges).

A 3D render of the 28-pin TSSOP component package that has a thermal pad (HTSSOP-28).

A 3D render of the 28-pin TSSOP component package that has a thermal pad (HTSSOP-28).

The HTTSOP-28 component package has the following thermal resistances:

SymbolDescriptionThermal Resistance
\( R_{\theta JA} \)Junction-to-ambient thermal resistance\(31.6^{\circ}C/W\)
\( R_{\theta JC (top)} \)Junction-to-case (top) thermal resistance\(15.9 ^{\circ}C/W\)
\( R_{\theta JC (bottom)} \)Junction-to-case (bottom) thermal resistance\(1.4^{\circ}C/W\)
\( R_{\theta JB} \)Junction-to-board thermal resistance\(5.6^{\circ}C/W\)

3D Renders

A 3D render of the TSSOP-38 component package.

A 3D render of the TSSOP-38 component package.

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