TSSOP Component Package

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TSSOP (Thin Shrink Small Outline Package) is a plastic, SMD IC component package with gull-wing leads.


  • PWP (PowerPAD) (TI’s name for the HTSSOP variant, independent on pin count)1
  • SOT1171-2 (NXP’s name for the HTSSOP-28)2
  • MO-153 (JEDEC’s name for the HTSSOP-28)2

Pin Count: 8-803


  • 0.50mm3
  • 0.65mm

Solderability: Reflow is most suitable. O.K. to solder by hand by an experienced user. Care must be taken to avoid solder bridges between the legs of the IC.

Common Uses:

  • General ICs
  • H-bridges (the HTSSOP variant)


A 3D render of the TSSOP-38 component package.

A 3D render of the TSSOP-38 component package.

Body widths of TSSOP packages can be 3.0, 4.4 and 6.1mm3.


HTSSOP is a variant of the TSSOP with a solder pad on the underside, used by both Texas Instruments and Rohm Semiconductor4 5. It is used for ICs which require good thermal conductivity (e.g. half-bridges, SMPS).

  • \(R_{\theta JA}\): Junction-to-ambient thermal resistance.
  • \(R_{\theta JB}\): Junction-to-board thermal resistance.
  • \(R_{\theta JC(top)}\): Junction-to-case (top) thermal resistance.
  • \(R_{\theta JC(bot)}\): Junction-to-case (bottom) thermal resistance.
Package NameBody Size (nominal)

\(R_{\theta JA}\)

\(R_{\theta JB}\)

\(R_{\theta JC(top)}\)

\(R_{\theta JC(bot)}\)

















\(25.2 ^{\circ}C/W\)1


A 3D render of the 28-pin TSSOP component package that has a thermal pad (HTSSOP-28).

A 3D render of the 28-pin TSSOP component package that has a thermal pad (HTSSOP-28).


  1. Texas Instruments (2020, May). DRV8424E/P, DRV8425E/P Dual H-Bridge Motor Drivers With Integrated Current Sense and Smart Tune Technology. Retrieved 2021-10-13, from https://www.ti.com/lit/ds/symlink/drv8424e.pdf↩︎ ↩︎ ↩︎ ↩︎ ↩︎ ↩︎

  2. NXP (2016, Feb 8). SOT1172-2 (Package Information). Retrieved 2021-10-13, from https://www.nxp.com/docs/en/package-information/SOT1172-2.pdf↩︎ ↩︎

  3. Wikipedia (2021, Jul). Thin shrink small outline package. Retrieved 2021-10-13, from https://en.wikipedia.org/wiki/Thin_shrink_small_outline_package↩︎ ↩︎ ↩︎

  4. Texas Instruments (2008, Jul). LM342x N -Channel Controllers for Constant-Current LED Drivers (Datasheet). Retrieved 2021-10-13, from https://www.ti.com/lit/ds/symlink/lm3421.pdf↩︎ ↩︎ ↩︎ ↩︎ ↩︎ ↩︎ ↩︎ ↩︎ ↩︎ ↩︎ ↩︎

  5. Rohm Semiconductor (2016, Sep 19). Package Information : HTSSOP-B28. Retrieved 2021-10-13, from https://fscdn.rohm.com/en/techdata_basic/ic/package/htssop-b28_1-e.pdf↩︎


Geoffrey Hunter

Dude making stuff.

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