TSSOP COMPONENT PACKAGE

TSSOP Component Package

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Date Published:	April 7, 2015
Last Modified:	October 13, 2021

1. Overview

Name

TSSOP (Thin Scale Small Outline Package)

Synonyms

PWP (PowerPAD) (TI’s name for the HTSSOP variant, independent on pin count)[3]
SOT1171-2 (NXP’s name for the HTSSOP-28)[2]
MO-153 (JEDEC’s name for the HTSSOP-28)[2]

Similar To

n/a

Mounting

SMD

Pin Count

8-80[4]

Pitch

0.50mm[4]
0.65mm

Solderability

Reflow is most suitable. O.K. to solder by hand by an experienced user. Care must be taken to avoid solder bridges between the legs of the IC.

Thermal Resistance

Package LxWxH

n/a

Typical PCB Land Area

3D Models

Common Uses

General ICs
H-bridges (the HTSSOP variant)

2. TSSOP

TSSOP (Thin Shrink Small Outline Package) is a plastic, SMD IC component package with gull-wing leads.

Figure 1. A 3D render of the TSSOP-38 component package.

Body widths of TSSOP packages can be 3.0, 4.4 and 6.1mm[4].

3. HTSSOP

There is a variant of the TSSOP with a solder pad on the underside. Texas Instruments calls this the HTSSOP package[1] (Rohm Semiconductor also uses this name[5]). It is used for ICs which require good thermal conductivity (e.g. half-bridges, SMPS).

\(R_{\theta JA}\): Junction-to-ambient thermal resistance.
\(R_{\theta JB}\): Junction-to-board thermal resistance.
\(R_{\theta JC(top)}\): Junction-to-case (top) thermal resistance.
\(R_{\theta JC(bot)}\): Junction-to-case (bottom) thermal resistance.

Package Name	Body Size (nominal)	\(R_{\theta JA}\)	\(R_{\theta JB}\)	\(R_{\theta JC(top)}\)	\(R_{\theta JC(bot)}\)
HTSSOP-16	5.00x4.40mm[1]	\(38.9^{\circ}C/W\)[1]	\(16.8^{\circ}C/W\)[1]	\(23.1^{\circ}C/W\)[1]	\(1.7^{\circ}C/W\)[1]
HTSSOP-20	6.50x4.40mm[1]	\(36.7^{\circ}C/W\)[1]	\(18^{\circ}C/W\)[1]	\(21.5^{\circ}C/W\)[1]	\(1.9^{\circ}C/W\)[1]
HTSSOP-28	9.70x4.40mm[3]	\(31.0^{\circ}C/W\)[3]	\(10.8^{\circ}C/W\)[3]	\(25.2 ^{\circ}C/W\)[3]	\(3.3^{\circ}C/W\)[3]

Package Name

Body Size (nominal)

\(R_{\theta JA}\)

\(R_{\theta JB}\)

\(R_{\theta JC(top)}\)

\(R_{\theta JC(bot)}\)

HTSSOP-16

5.00x4.40mm[1]

\(38.9^{\circ}C/W\)[1]

\(16.8^{\circ}C/W\)[1]

\(23.1^{\circ}C/W\)[1]

\(1.7^{\circ}C/W\)[1]

HTSSOP-20

6.50x4.40mm[1]

\(36.7^{\circ}C/W\)[1]

\(18^{\circ}C/W\)[1]

\(21.5^{\circ}C/W\)[1]

\(1.9^{\circ}C/W\)[1]

HTSSOP-28

9.70x4.40mm[3]

\(31.0^{\circ}C/W\)[3]

\(10.8^{\circ}C/W\)[3]

\(25.2 ^{\circ}C/W\)[3]

\(3.3^{\circ}C/W\)[3]

htssop 28 component package 3d render with thermal pad

Figure 2. A 3D render of the 28-pin TSSOP component package that has a thermal pad (HTSSOP-28).

References

[1] Texas Instruments (2008, Jul). LM342x N -Channel Controllers for Constant-Current LED Drivers (Datasheet). Retrieved 2021-10-13, from https://www.ti.com/lit/ds/symlink/lm3421.pdf.
[2] NXP (2016, Feb 8). SOT1172-2 (Package Information). Retrieved 2021-10-13, from https://www.nxp.com/docs/en/package-information/SOT1172-2.pdf.
[3] Texas Instruments (2020, May). DRV8424E/P, DRV8425E/P Dual H-Bridge Motor Drivers With Integrated Current Sense and Smart Tune Technology. Retrieved 2021-10-13, from https://www.ti.com/lit/ds/symlink/drv8424e.pdf.
[4] Wikipedia (2021, Jul). Thin shrink small outline package. Retrieved 2021-10-13, from https://en.wikipedia.org/wiki/Thin_shrink_small_outline_package.
[5] Rohm Semiconductor (2016, Sep 19). Package Information : HTSSOP-B28. Retrieved 2021-10-13, from https://fscdn.rohm.com/en/techdata_basic/ic/package/htssop-b28_1-e.pdf.

Authors

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