COMPONENT PACKAGES
TSSOP Component Package
Date Published: | |
Last Modified: |
Overview
Name | TSSOP (Thin Scale Small Outline Package) |
Synonyms | n/a |
Variants |
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Similar To | n/a |
Mounting | SMD |
Pin Count | n/a |
Pitch | n/a |
Solderability | O.K. to solder by hand by experienced user. Care must be taken to avoid solder bridges between the legs of the IC. |
Thermal Resistance | n/a |
Land Area | n/a |
Height | n/a |
3D Models | n/a |
Common Uses |
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Variants
There is a variant of the TSSOP with a solder pad on the underside. Texas Instruments calls this the HTSSOP package. It is used for ICs which require good thermal conductivity (e.g. half-bridges).
The HTTSOP-28 component package has the following thermal resistances:
Symbol | Description | Thermal Resistance |
---|---|---|
\( R_{\theta JA} \) | Junction-to-ambient thermal resistance | \(31.6^{\circ}C/W\) |
\( R_{\theta JC (top)} \) | Junction-to-case (top) thermal resistance | \(15.9 ^{\circ}C/W\) |
\( R_{\theta JC (bottom)} \) | Junction-to-case (bottom) thermal resistance | \(1.4^{\circ}C/W\) |
\( R_{\theta JB} \) | Junction-to-board thermal resistance | \(5.6^{\circ}C/W\) |
3D Renders
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