SOT-583 Component Package

A 3D render of the SOT-583 component package from Texas Instruments¹.

SOT-583 is an 8-lead SMD component package.

Synonyms

• FCSOT: Flipchip SOT, Texas Instruments
• SOT-583-8: Monolithic Power Systems

Dimensions

SOT-583 has a pitch of 0.5mm. The package is 2.1mm x 1.6mm (including pins). The dimensions are shown in the image below.

The dimensions of the SOT-583 component package from TI. Image from https://www.ti.com/lit/ml/mpcs002/mpcs002.pdf.

Recommended Footprint

The recommended footprint for the SOT-583 component package by TI. Image from https://www.ti.com/lit/ml/mpcs002/mpcs002.pdf.

Solderability

Hard but not impossible to solder by hand because of the small 0.5mm pitch. Reflow soldering is recommended.

Thermal Parameters

Junction-to-ambient thermal resistance	$R_{θJA}$	$110^\circ C \cdot W^{-1}$
Junction-to-case (top) thermal resistance	$R_{θJC(top)}$	$41.3^\circ C \cdot W^{-1}$
Junction-to-bottom (PCB) thermal resistance	$R_{θJB}$	$20^\circ C \cdot W^{-1}$
Junction-to-top characterization parameter	$\Psi_{JT}$	$0.8^\circ C \cdot W^{-1}$
Junction-to-bottom characterization parameter	$\psi_{JB}$	$20^\circ C \cdot W^{-1}$

All thermal parameters from https://www.ti.com/lit/ds/symlink/tps628501-q1.pdf.

Footnotes

1. Texas Instruments. TPS628512 - 2.7-V to 6-V, 2-A, fixed-frequency, step-down converter in SOT583 package. Retrieved 2024-04-19 from https://www.ti.com/product/TPS628512. ↩