TO-277A (SMPC) Component Package

Name (JEDEC)	TO-277A (Transistor Outline 277A)
Synonyms	SMPC (Vishay)
Variants	n/a
Similar To	n/a
Mounting	SMD
Pin Count	3 (2 pins + 1 pad)
Pitch	2.13mm (between pins 1 and 2, excluding the pad (pin 3))
Solderability	A little tricky to solder by hand, as this package has a pad. However, since the pad comes right to the edge, it can be done with a large and hot enough soldering iron tip. Easy to solder with with infrared or reflow techniques.
Thermal Resistance	$T_{JC} = 3^{\circ}{\rm C}/W$ $T_{JA} = 60^{\circ}{\rm C}/W$ (recommended land pattern, no thermal vias)
Physical Dimensions	Package Size: 4.60x6.50x1.10mm (widthlengthheight) Recommended Footprint Land Area: 4.8x6.8mm = 32.6mm2
3D Models	TO-277A(SMPC)
Common Uses	Medium/high power diodes.

Comments

Used by Vishay and Bruckewell.

3D Renders

A 3D render of the TO-277A component package.

Dimensions

Dimensions and land pattern for the TO-277A (SMPC) component package.