MiniMELF (SOD-80, DO-213AA) Component Package
MiniMELF
is a cylindrical, 2-lead SMD component package whose most common use is for packaging diodes and resistors. This package often comes under the alternative names SOD-80 or DO-213AA. I prefer to call it MiniMELF as it’s to remember when there are a plethora of other packages under the “SOD” or “DO-” naming convention.
MiniMELF (and all the other packages in the MELF family) are cylindrical shaped components. This makes them somewhat infamous because they have a tendency to roll around when soldering. This leads to the backronym “MELF: Most End up Lying on the Floor” or being called the “roll away” package. However, they remain popular because offer significant advantages over traditional SMD packages including:
- High accuracy
- Moisture resistance
- High-temperature operation
Synonyms:
- 100H01: IEC package outline code1.
- DO-213AA
- LL-34: Littelfuse2.
- LL34: Microsemi3.
- LLDS (Nexperia1)
- SOD-80 (Small-outline Diode 80)
- SOD-80C (Nexperia1)
Pitch: 3.2mm (distance between terminal centers)
Solderability: Easy to solder by hand, but doesn’t stay in one place! Can also be wave or reflow soldered.
Similar To:
Dimensions And Recommended Land Pattern
Package Dimensions: 3.5mm length, 1.5mm diameter
Common Uses
- Diodes
- Resistors
References
Footnotes
-
Nexperia (2017, Jan 30). SOD80C: Glass, hermetically sealed glass surface-mounted package; 2 connectors; 3.5 mm x 1.5 mm body (package information). Retrieved 2022-03-04, from https://assets.nexperia.com/documents/package-information/SOD80C.pdf. ↩ ↩2 ↩3
-
Littelfuse (2018, Feb 26). Surface Mount Thermistors: MELF Style Thermistor: LL 34 MiniMELF SM. Retrieved 2022-03-07, from https://www.littelfuse.com/~/media/electronics/datasheets/surface_mount_thermistors/littelfuse_surface_mount_thermistors_melf_style_thermistors_ll_34_minimelf_sm_datasheet.pdf.pdf. ↩
-
Microsemi. BZV55 C2V4 thru BZV55 C75 [datasheet]. Retrieved 2024-04-16, from https://nz.mouser.com/datasheet/2/268/BZV55_C2V4_C75-1593780.pdf. ↩