TSSOP Component Package

TSSOP (Thin Shrink Small Outline Package) is a plastic, SMD IC component package with gull-wing leads.

Synonyms:

• PWP (PowerPAD) (TI’s name for the HTSSOP variant, independent on pin count)¹
• SOT1171-2 (NXP’s name for the HTSSOP-28)²
• MO-153 (JEDEC’s name for the HTSSOP-28)²

Pin Count: 8-80³

Pitch:

• 0.50mm³
• 0.65mm

Solderability: Reflow is most suitable. O.K. to solder by hand by an experienced user. Care must be taken to avoid solder bridges between the legs of the IC.

Common Uses:

• General ICs
• H-bridges (the HTSSOP variant)

TSSOP

A 3D render of the TSSOP-38 component package.

Body widths of TSSOP packages can be 3.0, 4.4 and 6.1mm³.

HTSSOP

HTSSOP is a variant of the TSSOP with a solder pad on the underside, used by both Texas Instruments and Rohm Semiconductor^{4 5}. It is used for ICs which require good thermal conductivity (e.g. half-bridges, SMPS).

• $R_{\theta JA}$: Junction-to-ambient thermal resistance.
• $R_{\theta JB}$: Junction-to-board thermal resistance.
• $R_{\theta JC(top)}$: Junction-to-case (top) thermal resistance.
• $R_{\theta JC(bot)}$: Junction-to-case (bottom) thermal resistance.

Package Name	Body Size (nominal)	$R_{\theta JA}$	$R_{\theta JB}$	$R_{\theta JC(top)}$	$R_{\theta JC(bot)}$
HTSSOP-16	5.00x4.40mm4	$38.9^{\circ}C/W$4	$16.8^{\circ}C/W$4	$23.1^{\circ}C/W$4	$1.7^{\circ}C/W$4
HTSSOP-20	6.50x4.40mm4	$36.7^{\circ}C/W$4	$18^{\circ}C/W$4	$21.5^{\circ}C/W$4	$1.9^{\circ}C/W$4
HTSSOP-28	9.70x4.40mm1	$31.0^{\circ}C/W$1	$10.8^{\circ}C/W$1	$25.2 ^{\circ}C/W$1	$3.3^{\circ}C/W$1

A 3D render of the 28-pin TSSOP component package that has a thermal pad (HTSSOP-28).

Footnotes

1. Texas Instruments (2020, May). DRV8424E/P, DRV8425E/P Dual H-Bridge Motor Drivers With Integrated Current Sense and Smart Tune Technology. Retrieved 2021-10-13, from https://www.ti.com/lit/ds/symlink/drv8424e.pdf. ↩ ↩² ↩³ ↩⁴ ↩⁵ ↩⁶

2. NXP (2016, Feb 8). SOT1172-2 (Package Information). Retrieved 2021-10-13, from https://www.nxp.com/docs/en/package-information/SOT1172-2.pdf. ↩ ↩²

3. Wikipedia (2021, Jul). Thin shrink small outline package. Retrieved 2021-10-13, from https://en.wikipedia.org/wiki/Thin_shrink_small_outline_package. ↩ ↩² ↩³

4. Texas Instruments (2008, Jul). LM342x N -Channel Controllers for Constant-Current LED Drivers (Datasheet). Retrieved 2021-10-13, from https://www.ti.com/lit/ds/symlink/lm3421.pdf. ↩ ↩² ↩³ ↩⁴ ↩⁵ ↩⁶ ↩⁷ ↩⁸ ↩⁹ ↩¹⁰ ↩¹¹

5. Rohm Semiconductor (2016, Sep 19). Package Information : HTSSOP-B28. Retrieved 2021-10-13, from https://fscdn.rohm.com/en/techdata_basic/ic/package/htssop-b28_1-e.pdf. ↩