December 2024 Updates

Add Relay Contact Forms Info

Added information about relay contact forms, e.g. Form A, Form B, Form C, Form D, and Form X.

Added a Page on Chip Carrier Packages

Added information about chip carrier packages, including PLCC, LCC, LCCC, and BCC.

Started a Page on Designing a HAL in C++

Added information about designing a HAL in C++.

Started a PCB Rework Guide

Started a page on PCB reworking.

Added Info on the MFF2 (DFN-8) Package Used For eSIMs

Added information about the MFF2 (DFN-8) package used for eSIMs.