TO-Leadless Component Package

A 3D render of the TO-Leadless component package.

TO-Leadless is a component package is solely used by Infineon for a range of it’s high power MOSFETs¹. In this package, Infineon’s MOSFETs can achieve on-resistances as low as 0.4mΩ. It’s package size is 60% smaller than the D2PAK 7-pin package.

The package has 8 leads plus and exposed pad².

Below is a size comparison between DPAK (left) and TO-Leadless (right):

Size comparison between the TO-Leadless and DPAK component packages.

Synonyms

• PG-HSOF-8: Infineon name².

Dimensions

The dimensions of the TO-Leadless component package.

Footprint

The recommended land pattern for the TO-Leadless component package.

The recommended stencil pattern for the TO-Leadless component package.

Solderability

Not suitable for hand soldering due to pads underneath the package. Suitable for hot air and reflow soldering techniques

Thermal Resistance

• $R_{JC} = 0.4^{\circ}{\rm C}/W$
• $R_{JA} = 40^{\circ}{\rm C}/W$ (max)

Footnotes

1. Infineon. TO-Leadless (TOLL) OptiMOS™ package. Retrieved 2024-04-22, from https://www.infineon.com/cms/en/product/power/mosfet/n-channel/optimos-and-strongirfet-latest-packages/to-leadless/. ↩

2. Infineon. IPT026N10N5 - MOSFET - OptiMOS 5 Power-Transistor, 100V [datasheet]. Retrieved 2024-04-22, from https://www.infineon.com/dgdl/Infineon-IPT026N10N5-DS-v02_01-EN.pdf?fileId=5546d46269e1c019016ac029615332f7. ↩ ↩²