TO-247 Component Package
The TO-247
(Transistor Outline 247, JEDEC) is a family of large through-hole 3-leaded component packages commonly used for 3-leaded devices which dissipate a lot of thermal power, including BJTs and MOSFETs.
Variants:
Pitch: 5.45mm (0.215”)2
Solderability: Suitable for wave soldering. Easy to solder by hand.
Similar To:
- TO-218 (unlike the TO-247, this does not have an isolated mounting hole)
TO-247AC (TO-247-3)
The TO-247AC
(a.k.a. TO-247-3
) is the 3-pin variant of the TO-247
package. It is considered the “upgrade” of the TO-218
(SOT-93
), with the main difference being the insulated mounting hole, making it easier to mount to a heatsink without shorting things out (it is “mechanically compatible” with the TO-218
, however not identical!2).
Synonyms:
SOD-429
(Nexperia)CASE 340L-02
(On Semi)2
Common Uses:
- BJTs
- MOSFETs
When containing a MOSFET, the pin wiring is usually:
- Gate
- Drain
- Source
TO-247PLUS
The TO-247PLUS
packages (TO-247PLUS-3
and TO-247PLUS-4
) are variants of the TO-247
package by Infineon. The main difference is the removal of the mounting holes in the TO-247PLUS variants, plus some extended creepage distances for the TO-247PLUS1.
Footnotes
-
Infineon (2017, Feb 10). AN2017-01: TO-247PLUS - Description of the packages and assembly guidelines. Retrieved 2021-12-25, from https://www.infineon.com/dgdl/Infineon-Discrete_IGBT_in_TO-247PLUS-AN-v02_00-EN.pdf?fileId=5546d46249cd10140149e0c7fe9d56c7. ↩ ↩2 ↩3 ↩4
-
ON Semiconductor (2012, Jun 9). Final Product/Process Change Notification #16827: Package change from TO-218 to TO-247 for all Bipolar Power Transistors. Retrieved 2021-12-24, from https://www.mouser.com/PCN/ON%20Semiconductor_16827.pdf. ↩ ↩2 ↩3