TO-218 Component Package
The TO-218
(Transistor Outline 218, JEDEC) component package is a small family of through-hole packages commonly used for BJTs and MOSFETs. The 3-lead variant is the most common, but mention of a 1-lead variant exists (I’ve not found any real components which use this package!).
Variants:
- TO-218-1 (1 lead variant, have not found any components in this package, only a reference to it’s dimensions)
- TO-218-3 (3 lead variant, most common)
Similar To:
- TO-247 (the TO-247 is considered the “upgrade” from this package)
TO-218-3 (3 Lead Variant)
Synonyms:
Pitch: 5.45mm (0.215”)1
Package LxWxH: 15.20x4.90x20.35mm (max)3
Common Uses:
- BJTs
- MOSFETs
The below figure shows the dimensions of the TO-218-3 component package:
When housing a BJT, the pinout is usually:
- 1: Base
- 2: Collector
- 3: Emitter
- 4 (Tab): Collector
TO-218-1 (1 Lead Variant)
Fairchild Semiconductor has dimensions for a “single-lead” TO-218 package, as shown below. Curiously, I have not found any components that use this package.
Footnotes
-
On Semiconductor (2012, Jun 9). Final Product/Process Change Notification #16827: Package change from TO-218 to TO-247 for all Bipolar Power Transistors. Retrieved 2021-12-24, from https://www.mouser.com/PCN/ON%20Semiconductor_16827.pdf. ↩ ↩2
-
On Semi (2002, Mar 1). SOT-93 (TO-218): Mechanical Case Outline. Retrieved 2021-12-25, from https://www.onsemi.com/pub/Collateral/340D-02.PDF. ↩ ↩2
-
EESemi (2008). TO-218 Package. Retrieved 2021-12-24, from https://eesemi.com/to218.htm. ↩
-
Fairchild (2001, Oct). TO-218 Single Lead JEDEC Style TO-218 Plastic Package. Retrieved 202-12-24, from https://www.icbanq.com/icbank_data/semi_package/to218_dim.pdf. ↩