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SOT-223 Component Package

Published On:
Jan 8, 2015
Last Updated:
Dec 14, 2024

SOT-223 is a family of SMD component packages commonly used for medium-power discrete semiconductor components and basic ICs such as linear regulators. It is characterised by standard gull-wing pins on one side of the body and a larger tab on the other side.

There are three main variants in the SOT-223 family:

  • SOT-223-3 (3 pin excl. tab)
  • SOT-223-4 (4 pin excl. tab)
  • SOT-223-5 (5 pin excl. tab)

Members of the SOT-223 family are used for things such as MOSFETs, load switches, high-power linear regulators and current sources.

Conflicting Naming Conventions

This page associates the x in SOT-223-x to stand for the number of pins excluding the tab. This is the most popular convention.

SOT-223-3

The SOT-223-3 (TO-261AA) component package is the most common variant within the SOT-223 family. It looks similar to the SOT-23 package, but with a tab on one side instead of legs.

A 3D render of the TO-261AA (SOT-223-3) component package.

It is commonly used for medium-power linear regulators and load switches.

The tab is sometimes electrically connected to pin 2 (the middle pin on the other side of the package), or sometimes electrically isolated for all other pins and called pin 4. For example, the AZ1117I linear regulator from Diodes Incorporated connects the tab to pin 2:

The pin diagram for the AZ1117I in a SOT-223 package. Note how the tab is connected to pin 2.

Synonyms

  • DCY: Texas Instruments1.
  • KC-3: Analog Devices’ name2.
  • MP04A: National Semiconductor’s drawing number3.
  • PG-SOT-223-4: Infineon’s name4.
  • R-PDSO-G4: Texas Instruments1.
  • TO-261-4: JEDEC name5.
  • TO-261AA: JEDEC name5 2.

Thermal Resistance

Texas Instruments gives the following thermal resistance data for the SOT-223-3 package (taken from http://www.ti.com/lit/ds/symlink/tps7b6933-q1.pdf, as of Dec 2017, URL is unavailable).

PropertySymbolValue
Junction-to-ambient thermal resistanceRθJAR_{\theta JA}64.2C/W64.2^{\circ}C/W
Junction-to-case (top) thermal resistanceRθJC(top)R_{\theta JC(top)}46.8C/W46.8^{\circ}C/W
Junction-to-board thermal resistanceRθJBR_{\theta JB}13.3C/W13.3^{\circ}C/W
Junction-to-top characterisation parameterRψJTR_{\psi JT}6.3C/W6.3^{\circ}C/W
Junction-to-board characterisation parameterRψJBR_{\psi JB}13.2C/W13.2^{\circ}C/W

All of the parameters in the above table were measured with the SOT-223-3 package soldered to a JEDEC standard high-K profile, JESD 51-7, 2s2p four layer board with 2-oz copper. The copper pad was soldered to the thermal land pattern.

The thermal resistance of the TO-261AA (SOT-223-3) component package for various PCB footprints.

Standard Linear Regulator Pinout

The SOT-223-3 package is commonly used for small, medium-power linear regulators. There is a de-facto standard pinout that many manufacturers use when incorporating a linear regulator into the SOT-223-3 package:

The de-facto standard pinout for a linear regulator inside a SOT-223-3 package. This image also shows the standard PCB footprint used to achieve a low thermal resistance. Image from http://www.ti.com/.

Standard Load Switch Pinout

The SOT-223-3 package is commonly used for smaller low and high-side load switches. As such, there is a de-facto standard pinout that many manufacturers use for load switches in the SOT-223-3 package:

The de-facto standard pinout for a load switch in a SOT-223-3 package. Image from http://www.infineon.com/.

SOT-223-4

This variant can be confused with the three pin and one pad variant (SOT-223-3) if you decide to count the pad as well as the pins in the number.

A 3D render of the SOT-223-4 component package. Image from http://www.datasheetdir.com/.

SOT-223-5

Synonyms

  • DCQ: Texas Instruments.
  • R-PDSO-G6: Texas Instruments.

Dimensions

Below are the dimensions of the SOT-223-5 package as specified by Texas Instruments.

The dimensions of the SOT-223-5 component package. Image from http://www.ti.com/.

Footprint (Land Pattern)

Below is the recommended footprint (land pattern) for the SOT-223-5 component package as specified by Texas Instruments.

A recommended footprint (land pattern) for the SOT-223-5 component package. Image from http://www.ti.com/.

Thermal Resistance

Below is a graph showing the thermal resistance of the SOT-223-5 package with varying copper area.

Graph of thermal resistance vs. copper area for the SOT-223-5 component package. Image from http://www.ti.com/.

As you can see, as the copper area increases, the thermal resistance decreases asymptotically to around 55C/W55^{\circ}{\rm C}/W.

Similar To

Footnotes

  1. Texas Instruments (2002, Jun). DCY (R-PDSO-G4). Retrieved 2024-04-19, from https://www.ti.com/lit/ml/mpds094a/mpds094a.pdf. 2

  2. Analog Devices. 3-Lead Small Outline Transistor Package [SOT-223] - (KC-3). Retrieved 2024-04-19, from https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sot_223kc/kc_3.pdf. 2

  3. National Semiconductor. LM3940 - 1A Low Dropout Regulator for 5V to 3.3V Conversion [datasheet]. Retrieved 2024-04-19, from https://datasheet.octopart.com/LM3940IMP-3.3-National-Semiconductor-datasheet-8805184.pdf.

  4. Infineon. HITFET - BTS3205N - Smart Low-Side Power Switch. Retrieved 2024-04-19, from https://www.infineon.com/dgdl/Infineon-BTS3205N-DS-v01_01-en.pdf?fileId=db3a30431ed1d7b2011f4ba4f81d5ec6.

  5. TopLine. TO261 - SOT223 - JEDEC TO-261AA Package - TopLine Dummy Component. Retrieved 2024-04-19, from https://www.topline.tv/TO261.html. 2