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SSOP Component Package

Authors:
Geoffrey Hunter
Geoffrey Hunter
Published On:
Dec 2, 2025
Last Updated:
Dec 2, 2025

SSOP (Shrink Small Outline Package) is a family of plastic, SMD IC component packages with gull-wing leads.1 They can have both varying pitches and body widths.

A 3D render of the SSOP-24 4x8.74mm package from AMS-OSRAM.

Synonyms:

  • DB: The Texas Instrument code for the SSOP-16 5.3x6.2mm body package.2
  • DBQ: The Texas Instrument code for the SSOP-16 3.9x4.9 mm body package.2

Pitch:1

  • 0.635mm (unusual pitch used by Texas Instruments for their SSOP-16 3.9x4.9 mm body package (DBQ))2
  • 0.65mm (most common pitch)
  • 0.80mm (rare)
  • 1.27mm (rare)

The SSOP package can come in a few different body widths:

  • 3.9 mm2
  • 4.4 mm3
  • 5.3 mm2

Solderability: Reflow is most suitable. O.K. to solder by hand by an experienced user. Care must be taken to avoid solder bridges between the legs of the IC.

Common Uses:

  • Logic ICs in the 74 series.

Similar To:

  • SOP: SOP has a larger pitch and is used for things such as optical isolators.
  • TSSOP: TSSOP is usually thinner with a height of around 1.2 mm, compared to the approx. 2.0 mm height of the SSOP package.

SSOP-16, 0.65 mm Pitch, 5.3x6.2 mm Body (DB)

The SSOP-16 with a 5.3x6.2mm body is shown in This is a placeholder for the reference: fig-ti-ssop-16-db0016a-package-dimensions.

The dimensions for the Texas Instruments SSOP-16 DB component package.2

Footnotes

  1. MADPCB. Glossary > SSOP. Retrieved 2025-12-02, from https://www.madpcb.com/glossary/ssop. ↩ ↩2

  2. Texas Instruments (2015, Dec). SN74CBT3251 - 1-of-8 FET Multiplexer and Demultiplexer [datasheet]. Retrieved 2025-12-02, from https://www.ti.com/lit/ds/symlink/sn74cbt3251.pdf. ↩ ↩2 ↩3 ↩4 ↩5 ↩6

  3. Nisshinbo Microdevices. NJM062C/064C NJM062CA/064CA - Low Power J-FET Input Operational Amplifiers [datasheet]. Retrieved 2025-12-02, from https://www.nisshinbo-microdevices.co.jp/en/pdf/datasheet/NJM062C_NJM062CA_NJM064C_NJM064CA_E.pdf. ↩