NinjaCalc
Component Packages
Published On:
Sep 3, 2011
Last Updated:
Dec 13, 2024
Most electronic components come in standardized packages. A package type has well a defined set of physical dimensions that the component has to conform to. For each package, normally the pitch spacing, height and general shape is defined. However most packages contain variants with a differing number of leads (for example the classic old-school DIP package comes in 4, 8, and 10 lead variants just to name a few). This means that total land area and size of a package can vary according to how many leads it has.
Standardizing components sizes and shapes makes it easier for the component manufacturer, the PCB manufacturer, and the design engineer. Although most components are standardized, there are still plenty of packages out there. This pages purpose is to hopefully make some sense of the most common and widely used packages and to help anyone choosing a component package or designing a PCB.
Component Package Database
Packages are listed alphabetically below. Click on any package to see more information.
All land-area (occupied PCB space) calculations are based around the minimum-sized square that encloses the entire package. This does not take into account the size of the pads required on the PCB, which would increase the calculation by a small amount. Nominal package dimensions used for calculation.
Click on any photo to expand into a full-sized version.
Component packages with many names (synonyms) are listed by the most common, or most “popular” name, which is not necessarily the technically correct name.
Some items such as the PP3 9V battery case, and SIM card sizes, may not be strictly component packages, but are included here for completeness.
1-3G1G Component Package
1-3G1G Component Package
2-2H1S Component Package
2-2H1S Component Package
2-3AB1A Component Package
2-3AB1A Component Package
463C-03 Component Package
463C-03 Component Package
526AG Component Package
526AG Component Package
BCC Component Package
BCC is a variant within the chip carrier package family.
BCC Component Package
BCC is a variant within the chip carrier package family.
BGA is a high-density SMD component package which can have from 4 to 1700+ pins. The pins are solder balls which are arranged in a grid on the underside of the package.
BGA Component Package
BGA is a high-density SMD component package which can have from 4 to 1700+ pins. The pins are solder balls which are arranged in a grid on the underside of the package.
Chip carrier packages are a family of large SMD packages that hold ICs with leads on all four sides of the package. One of the most common variants is the PLCC package with J leads.
Chip Carrier Packages
Chip carrier packages are a family of large SMD packages that hold ICs with leads on all four sides of the package. One of the most common variants is the PLCC package with J leads.
Chip (EIA xxxx) components are family of very popular rectangular SMD cuboid packages, commonly used for resistors and capacitors.
Chip (EIA) Component Packages
Chip (EIA xxxx) components are family of very popular rectangular SMD cuboid packages, commonly used for resistors and capacitors.
Crystals come in a variety of through-hole and SMD packages. Older crystals use through-hole packages that looked like shiny metal cans, where modern crystals usually come in small SMD packages with 2 or 4 leads and look like ICs.
Crystal Packages
Crystals come in a variety of through-hole and SMD packages. Older crystals use through-hole packages that looked like shiny metal cans, where modern crystals usually come in small SMD packages with 2 or 4 leads and look like ICs.
D2PAK Component Package
D2PAK is a synonym for the TO-263 component package.
D2PAK Component Package
D2PAK is a synonym for the TO-263 component package.
D3PAK Component Package
D3PAK is a synonym for the TO-268 component package.
D3PAK Component Package
D3PAK is a synonym for the TO-268 component package.
DDDPAK Component Package
DDDPAK is a synonym for the TO-268 component package.
DDDPAK Component Package
DDDPAK is a synonym for the TO-268 component package.
DDPAK Component Package
DDPAK is a synonym for the TO-263 component package.
DDPAK Component Package
DDPAK is a synonym for the TO-263 component package.
DFN (a.k.a. SON) is a popular SMD component package with pins running down two of its sides. It is commonly used for MOSFETs, flash memory ICs and other devices.
DFN Component Package
DFN (a.k.a. SON) is a popular SMD component package with pins running down two of its sides. It is commonly used for MOSFETs, flash memory ICs and other devices.
DIP is an popular through-hole component package typically used for ICs.
DIP Component Package
DIP is an popular through-hole component package typically used for ICs.
DO-103AA Component Package
DO-103AA is a synonym for the MiniMELF component package.
DO-103AA Component Package
DO-103AA is a synonym for the MiniMELF component package.
DO-103AB Component Package
DO-103AB is a synonym for the MELF component package.
DO-103AB Component Package
DO-103AB is a synonym for the MELF component package.
DO-14 Component Package
DO-14 is a synonym for the DO-204AB component package.
DO-14 Component Package
DO-14 is a synonym for the DO-204AB component package.
DO-15 Component Package
DO-15 is a synonym for the DO-204AC component package.
DO-15 Component Package
DO-15 is a synonym for the DO-204AC component package.
DO-204 (a.k.a. DO-7) is an older 2-lead hermetically sealed glass through-hole package used for diodes.
DO-204AA (DO-7) Component Package
DO-204 (a.k.a. DO-7) is an older 2-lead hermetically sealed glass through-hole package used for diodes.
DO-204AB (DO-14) Component Package
Dimensions, recommended PCB footprints, variants, synonyms and more for the DO-204AB (DO-14) component package.
DO-204AB (DO-14) Component Package
Dimensions, recommended PCB footprints, variants, synonyms and more for the DO-204AB (DO-14) component package.
DO-204AC (DO-15) is an older through-hole axial component package used for diodes.
DO-204AC (DO-15) Component Package
DO-204AC (DO-15) is an older through-hole axial component package used for diodes.
DO-204AH (DO-35) is an older through-hole axial component package used for diodes. It was commonly used for small-signal low-power diodes such as the general purpose 1N414x series and the Zener BZX55 series.
DO-204AH (DO-35) Component Package
DO-204AH (DO-35) is an older through-hole axial component package used for diodes. It was commonly used for small-signal low-power diodes such as the general purpose 1N414x series and the Zener BZX55 series.
DO-204AL (DO-41) is a component package commonly used for older through-hole medium current diodes such as the 1N400x series.
DO-204AL (DO-41) Component Package
DO-204AL (DO-41) is a component package commonly used for older through-hole medium current diodes such as the 1N400x series.
DO-213AA Component Package
DO-213AA (MiniMELF) is a synonym for MiniMELF package.
DO-213AA Component Package
DO-213AA (MiniMELF) is a synonym for MiniMELF package.
DO-214AA Component Package
DO-214AA (SMB) is a synonym for SMB package.
DO-214AA Component Package
DO-214AA (SMB) is a synonym for SMB package.
DO-214AB Component Package
DO-214AB is a synonym for the SMC package.
DO-214AB Component Package
DO-214AB is a synonym for the SMC package.
DO-214AC Component Package
DO-214AC is a synonym for the SMA package.
DO-214AC Component Package
DO-214AC is a synonym for the SMA package.
DO-219AA Component Package
DO-219AA is a synonym for the SOD-123F package, the flat-lead variant of the SOD-123 package family.
DO-219AA Component Package
DO-219AA is a synonym for the SOD-123F package, the flat-lead variant of the SOD-123 package family.
DO-219AB Component Package
DO-219AB is a synonym for the SMF package.
DO-219AB Component Package
DO-219AB is a synonym for the SMF package.
DO-34 (Diode Outline 34) is a hermetically sealed axial 2-lead through-hole glass package used for diodes.
DO-34 Component Package
DO-34 (Diode Outline 34) is a hermetically sealed axial 2-lead through-hole glass package used for diodes.
DO-35 (DO-204AH) Component Package
DO-35 is a synonym for the DO-204AH package.
DO-35 (DO-204AH) Component Package
DO-35 is a synonym for the DO-204AH package.
DO-41 is a older JEDEC name for the DO-204AL component package.
DO-41 Component Package
DO-41 is a older JEDEC name for the DO-204AL component package.
DO-7 Component Package
DO-7 is a synonym for the DO-204AA component package.
DO-7 Component Package
DO-7 is a synonym for the DO-204AA component package.
DPACK Component Package
DPACK is a synonym for the TO-252-3 package.
DPACK Component Package
DPACK is a synonym for the TO-252-3 package.
DRL|6 Component Package
DRL|6 is a synonym for the SOT-563 package.
DRL|6 Component Package
DRL|6 is a synonym for the SOT-563 package.
DSOP Advance is a SMD component package used by Toshiba that has thermal pads on both the underside and topside of the package.
DSOP Advance Component Package
DSOP Advance is a SMD component package used by Toshiba that has thermal pads on both the underside and topside of the package.
E-Line is a through-hole component package that is very similar to the TO-92 package, except it has more of a flat face on one side.
E-Line Component Package
E-Line is a through-hole component package that is very similar to the TO-92 package, except it has more of a flat face on one side.
EEP Component Package
EEP Component Package
EMD3F Component Package
EMD3F Component Package
EMT3 Component Package
EMT3 Component Package
EMT3F Component Package
EMT3F Component Package
HC-49/US Component Package
HC-49/US Component Package
HU3PAK Component Package
Pin count, solderability, thermal resistance, dimensions, land pattern, 3D models and more info for the HU3PAK component package.
HU3PAK Component Package
Pin count, solderability, thermal resistance, dimensions, land pattern, 3D models and more info for the HU3PAK component package.
LFCSP Component Package
LFCSP Component Package
LGA Component Package
LGA Component Package
LL-34 Component Package
LL-34 Component Package
Macro X Component Package
Macro X Component Package
MELF is a 2-lead cylindrically-shaped SMD component package. It is a hermetically sealed glass-based package, which offers components with superb reliability characteristics. They are a pain to solder because they roll around!
MELF Component Package
MELF is a 2-lead cylindrically-shaped SMD component package. It is a hermetically sealed glass-based package, which offers components with superb reliability characteristics. They are a pain to solder because they roll around!
Micro SOP Component Package
Micro SOP Component Package
Micro3 Component Package
Micro3 Component Package
MicroMELF is a small 2-lead SMD component package. It is the smallest package in the family also containing the MELF and MiniMELF packages.
MicroMELF Component Package
MicroMELF is a small 2-lead SMD component package. It is the smallest package in the family also containing the MELF and MiniMELF packages.
MicroSiP Component Package
MicroSiP Component Package
Mini-DIP SPM
Mini-DIP SPM
MiniMELF is a cylindrical, 2-lead SMD component package. It is a hermetically sealed glass-based package, which offers components with superb reliability characteristics. Like it's larger MELF cousin, they are a pain to solder because they roll around!
MiniMELF (SOD-80, DO-213AA) Component Package
MiniMELF is a cylindrical, 2-lead SMD component package. It is a hermetically sealed glass-based package, which offers components with superb reliability characteristics. Like it's larger MELF cousin, they are a pain to solder because they roll around!
MLP Component Package
MLP Component Package
MPAK Component Package
MPAK Component Package
MSOP is a family of SMD component packages with gull-wing leads. It is a miniaturized version of the SSOP package.
MSOP Component Package
MSOP is a family of SMD component packages with gull-wing leads. It is a miniaturized version of the SSOP package.
PDIP is a variant of the DIP package that uses plastic for the enclosure.
PDIP Component Package
PDIP is a variant of the DIP package that uses plastic for the enclosure.
PDMU is a synonym for the SOD-123F used by Rohm Semiconductor, the flat-lead variant of the SOD-123 package family.
PDMU Component Package
PDMU is a synonym for the SOD-123F used by Rohm Semiconductor, the flat-lead variant of the SOD-123 package family.
PG-SCT595 Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the SOT-23 component package.
PG-SCT595 Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the SOT-23 component package.
PLCC is a variant within the chip carrier package family.
PLCC Component Package
PLCC is a variant within the chip carrier package family.
PowerDI123 Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the PowerDI123 component package.
PowerDI123 Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the PowerDI123 component package.
PowerPAK SO-8 Component Package
PowerPAK SO-8 Component Package
PP3 is the name for the most common 9V battery size.
PP3 Component Package
PP3 is the name for the most common 9V battery size.
PP9 is a less common 9V battery component package that is similar to the common PP3 package.
PP9 Component Package
PP9 is a less common 9V battery component package that is similar to the common PP3 package.
QFN is a family of SMD packages with pads around all four sides, plus an optional thermal pad in the center. Along with QFP, it is commonly used for medium pin count ICs.
QFN Component Package
QFN is a family of SMD packages with pads around all four sides, plus an optional thermal pad in the center. Along with QFP, it is commonly used for medium pin count ICs.
QFP is a family of SMD packages with gull-wing leads protruding from all four sides. It is commonly used for medium pin count ICs.
QFP Component Package
QFP is a family of SMD packages with gull-wing leads protruding from all four sides. It is commonly used for medium pin count ICs.
QIP is an older through-hole component package with four rows of pins, rather than the more common two rows of pins found in the DIP package.
QIP Component Package
QIP is an older through-hole component package with four rows of pins, rather than the more common two rows of pins found in the DIP package.
RT-3 Component Package
RT-3 Component Package
SC-101 Component Package
SC-101 Component Package
SC-104A Component Package
SC-104A Component Package
SC-109D Component Package
SC-109D Component Package
SC-116A Component Package
SC-116A Component Package
SC-59 Component Package
SC-59 Component Package
SC-63 Component Package
SC-63 Component Package
SC-70-5 Component Package
SC-70-5 Component Package
SC-70 Component Package
SC-70 Component Package
SC-74A Component Package
SC-74A Component Package
SC-75 Component Package
SC-75 Component Package
SC-76 Component Package
SC-76 Component Package
SC-79 Component Package
SC-79 Component Package
SC-88A Component Package
SC-88A Component Package
SC-89 Component Package
SC-89 Component Package
SIM Card Sizes
SIM Card Sizes
SIP Component Package
SIP Component Package
SMA (DO-214AC) is a 2-lead SMD component package commonly used for diodes. SMA is the smallest package in the family containing SMA, SMB and SMC.
SMA (DO-214AC) Component Package
SMA (DO-214AC) is a 2-lead SMD component package commonly used for diodes. SMA is the smallest package in the family containing SMA, SMB and SMC.
SMB (DO-214AA) is a 2-lead SMD component package commonly used for diodes. It is in the same family as SMA (DO-214AC) and SMC (DO-214AB).
SMB (DO-214AA) Component Package
SMB (DO-214AA) is a 2-lead SMD component package commonly used for diodes. It is in the same family as SMA (DO-214AC) and SMC (DO-214AB).
SMC (DO-214AB) is a 2-lead SMD component package commonly used for diodes. It is the largest package in the family containing SMA, SMB and SMC.
SMC (DO-214AB) Component Package
SMC (DO-214AB) is a 2-lead SMD component package commonly used for diodes. It is the largest package in the family containing SMA, SMB and SMC.
SMD-220 Component Package
SMD-220 Component Package
SMD electrolytic capacitors come in a variety of industry standard packages.
SMD Electrolytic Capacitor Packages
SMD electrolytic capacitors come in a variety of industry standard packages.
SMD inductors come in a variety of packages, but are not as standardized as other SMD components.
SMD Inductor Packages
SMD inductors come in a variety of packages, but are not as standardized as other SMD components.
SMD tantalum capacitors are generally packaged in yellow or orange rectangular packages with two leads.
SMD Tantalum Capacitor Packages
SMD tantalum capacitors are generally packaged in yellow or orange rectangular packages with two leads.
SMD35 Component Package
SMD35 Component Package
SMF Component Package
SMF Component Package
SMT3 Component Package
SMT3 Component Package
SNAPHAT Component Package
SNAPHAT Component Package
SOD-106 Component Package
SOD-106 Component Package
SOD-110 Component Package
SOD-110 Component Package
SOD-123 is a family of medium-sized SMD component packages with gull-wing leads. It is related to the SOD-323, SOD-523, SOD-723 and SOD-923 packages. It is commonly used for diodes.
SOD-123 Component Package
SOD-123 is a family of medium-sized SMD component packages with gull-wing leads. It is related to the SOD-323, SOD-523, SOD-723 and SOD-923 packages. It is commonly used for diodes.
SOD-123F is a variant of the SOD-123 package with flat leads.
SOD-123F Component Package
SOD-123F is a variant of the SOD-123 package with flat leads.
SOD-128 is a 2 flat lead SMD component package used by a few manufacturers for diodes.
SOD-128 Component Package
SOD-128 is a 2 flat lead SMD component package used by a few manufacturers for diodes.
SOD-27 is a NXP synonym for the DO-34 package, a hermetically sealed, 2 lead glass TH package used for diodes.
SOD-27 Component Package
SOD-27 is a NXP synonym for the DO-34 package, a hermetically sealed, 2 lead glass TH package used for diodes.
SOD-323 is a family of 2 lead SMD component packages, commonly used for diodes. It is related to the SOD-123, SOD-523, SOD-723 and SOD-923 packages.
SOD-323 Component Package
SOD-323 is a family of 2 lead SMD component packages, commonly used for diodes. It is related to the SOD-123, SOD-523, SOD-723 and SOD-923 packages.
SOD-429 Component Package
SOD-429 Component Package
SOD-523 is a 2 lead SMD component package commonly used for diodes. It is related to the SOD-123, SOD-323, SOD-723 and SOD-923 packages.
SOD-523 Component Package
SOD-523 is a 2 lead SMD component package commonly used for diodes. It is related to the SOD-123, SOD-323, SOD-723 and SOD-923 packages.
SOD-563 Component Package
SOD-563 Component Package
SOD-57 is a older glass passivated hermetically sealed 2-lead through-hole component package used for diodes that was somewhat popular in the late 1970s and 1980s.
SOD-57 Component Package
SOD-57 is a older glass passivated hermetically sealed 2-lead through-hole component package used for diodes that was somewhat popular in the late 1970s and 1980s.
SOD-64 is a older glass passivated hermetically sealed 2-lead through-hole component package used for diodes that was somewhat popular in the late 1970s and 1980s.
SOD-64 Component Package
SOD-64 is a older glass passivated hermetically sealed 2-lead through-hole component package used for diodes that was somewhat popular in the late 1970s and 1980s.
SOD-66 Component Package
SOD-66 Component Package
SOD-723 (SC-104A) Component Package
SOD-723 (SC-104A) Component Package
SOD-80 Component Package
SOD-80 Component Package
SOD-882 Component Package
SOD-882 Component Package
SOD-923 Component Package
SOD-923 Component Package
SOIC is a family of larger pitch SMD component packages that have gull-wing leads on two sides. There are three different widths of SOIC packages.
SOIC Component Package
SOIC is a family of larger pitch SMD component packages that have gull-wing leads on two sides. There are three different widths of SOIC packages.
SOJ is a family of SMD component packages with J-type leads on two sides. It is commonly used to house ICs. It is related to the PLCC package which has J-type leads on all four sides.
SOJ Component Package
SOJ is a family of SMD component packages with J-type leads on two sides. It is commonly used to house ICs. It is related to the PLCC package which has J-type leads on all four sides.
SON Component Package
Synonyms, variants, dimensions, recommended footprints, thermal resistance and more info about the SON (DFN) component package.
SON Component Package
Synonyms, variants, dimensions, recommended footprints, thermal resistance and more info about the SON (DFN) component package.
SOP is a family of SMD component packages with gull-wing leads on two sides.
SOP Component Package
SOP is a family of SMD component packages with gull-wing leads on two sides.
SOT-1040-1 Component Package
SOT-1040-1 Component Package
SOT-106A Component Package
SOT-106A Component Package
SOT-1193 Component Package
SOT-1193 Component Package
SOT-1226-2 Component Package
SOT-1226-2 Component Package
SOT-143 Component Package
SOT-143 Component Package
SOT-1571-1 Component Package
SOT-1571-1 Component Package
SOT-162-1 Component Package
SOT-162-1 Component Package
SOT-223 is a family of SMD component packages with gull-wing leads on one side and a tab on the other side. It is commonly used for medium-power discrete semiconductor components and basic ICs such as linear regulators.
SOT-223 Component Package
SOT-223 is a family of SMD component packages with gull-wing leads on one side and a tab on the other side. It is commonly used for medium-power discrete semiconductor components and basic ICs such as linear regulators.
SOT-23 is a popular medium-sized SMD package with 3 to 8 gull-wing leads. It is used for a wide range of devices such as linear regulators, BJTs, MOSFETs and diodes.
SOT-23 Component Package
SOT-23 is a popular medium-sized SMD package with 3 to 8 gull-wing leads. It is used for a wide range of devices such as linear regulators, BJTs, MOSFETs and diodes.
SOT-23F is a 3-pin SMD component package that is very similar to the SOT-23 package, except the leads are flat rather than gull-wing.
SOT-23F Component Package
SOT-23F is a 3-pin SMD component package that is very similar to the SOT-23 package, except the leads are flat rather than gull-wing.
SOT-323 is a family of SMD component packages with gull-wing leads on two sides. The most popular variant is the SOT-323-3 (SC-70-3) which is commonly used for transistors.
SOT-323 Component Package
SOT-323 is a family of SMD component packages with gull-wing leads on two sides. The most popular variant is the SOT-323-3 (SC-70-3) which is commonly used for transistors.
SOT-346 Component Package
SOT-346 is a synonym of the SOT-23-3 package.
SOT-346 Component Package
SOT-346 is a synonym of the SOT-23-3 package.
SOT-353 Component Package
SOT-353 Component Package
SOT-363 (SC-88, TSSOP6) is a SMD component package with gull-wing leads on two sides.
SOT-363 (SC-88) Component Package
SOT-363 (SC-88, TSSOP6) is a SMD component package with gull-wing leads on two sides.
SOT-416 Component Package
SOT-416 Component Package
SOT-428 Component Package
SOT-428 Component Package
SOT-457 Component Package
SOT-457 Component Package
SOT-490 Component Package
SOT-490 Component Package
SOT-523F Component Package
SOT-523F Component Package
SOT-563 Component Package
SOT-563 Component Package
SOT-583 Component Package
SOT-583 Component Package
SOT-665 Component Package
SOT-665 Component Package
SOT-723 Component Package
SOT-723 Component Package
SOT-753 Component Package
SOT-753 Component Package
SOT-762-1 Component Package
SOT-762-1 Component Package
Dimensions, recommended footprints, synonyms, common uses, thermal resistances and more info on the SOT-883 component package.
SOT-883 Component Package
Dimensions, recommended footprints, synonyms, common uses, thermal resistances and more info on the SOT-883 component package.
SOT-886 Component Package
SOT-886 Component Package
SOT-89 Component Package
SOT-89 Component Package
SOT-902 Component Package
SOT-902 Component Package
SOT-923 Component Package
SOT-923 Component Package
SOT-93 Component Package
SOT-93 Component Package
SPM23 Component Package
SPM23 Component Package
SuperSOT-3 Component Package
SuperSOT-3 Component Package
TO-18 Component Package
TO-18 Component Package
TO-204 AA Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-204 AA component package.
TO-204 AA Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-204 AA component package.
TO-204 AD Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-204 AD component package.
TO-204 AD Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-204 AD component package.
TO-204 AE Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-204 AE component package.
TO-204 AE Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-204 AE component package.
TO-205AD Component Package
TO-205AD Component Package
TO-206 Component Package
TO-206 Component Package
TO-209AB Component Package
TO-209AB Component Package
TO-218 Component Package
TO-218 Component Package
TO-220 Component Package
Dimensions, land patterns and more info for TO-220 package variants such as TO-220AB, TO-220AC and TO-220-7.
TO-220 Component Package
Dimensions, land patterns and more info for TO-220 package variants such as TO-220AB, TO-220AC and TO-220-7.
TO-226 Component Package
TO-226 Component Package
TO-23 Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-23 component package.
TO-23 Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-23 component package.
TO-236AA Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-236AA component package.
TO-236AA Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-236AA component package.
TO-236AB Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-236AB component package.
TO-236AB Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-236AB component package.
TO-247 Component Package
TO-247 Component Package
TO-247AC Component Package
TO-247AC Component Package
TO-252 (DPAK) Component Package
TO-252 (DPAK) Component Package
TO-253-4 Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-253AA component package.
TO-253-4 Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-253AA component package.
TO-253AA Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-253AA component package.
TO-253AA Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-253AA component package.
TO-261-4 Component Package
TO-261-4 Component Package
TO-261AA Component Package
TO-261AA Component Package
TO-263 Component Package
TO-263 Component Package
TO-268 (D3PAK) Component Package
TO-268 (D3PAK) Component Package
TO-273AA Component Package
Dimensions, land patterns, thermal resistances and more info on the TO-273AA (Super TO-220) component package.
TO-273AA Component Package
Dimensions, land patterns, thermal resistances and more info on the TO-273AA (Super TO-220) component package.
TO-277A (SMPC) Component Package
TO-277A (SMPC) Component Package
TO-279 Component Package
TO-279 Component Package
TO-3 Component Package
TO-3 Component Package
TO-39 Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TQFP component package.
TO-39 Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TQFP component package.
TO-46 Component Package
TO-46 Component Package
TO-5 Component Package
TO-5 Component Package
TO-52 Component Package
TO-52 Component Package
TO-72 Component Package
TO-72 Component Package
TO-92 (TO-226) Component Package
TO-92 (TO-226) Component Package
TO-93 (TO-209AB) Component Package
Variants, pin counts, pitch and more info about the TO-93 component package.
TO-93 (TO-209AB) Component Package
Variants, pin counts, pitch and more info about the TO-93 component package.
TO-99 Component Package
Variants, pin counts, pitch and more info about the TO-99 component package.
TO-99 Component Package
Variants, pin counts, pitch and more info about the TO-99 component package.
TO-Leadless Component Package
TO-Leadless Component Package
TO-PMOD-7 Component Package
TO-PMOD-7 Component Package
TQFP Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TQFP component package.
TQFP Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TQFP component package.
TSOC Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TSOC component package.
TSOC Component Package
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TSOC component package.
TSSOP Component Package
TSSOP Component Package
uMAX Component Package
uMAX Component Package
uSiP Component Package
Synonyms, variants, dimensions, 3D models, land patterns and more info on the uSiP component package.
uSiP Component Package
Synonyms, variants, dimensions, 3D models, land patterns and more info on the uSiP component package.
USON Component Package
Synonyms, variants, dimensions, 3D models, land patterns and more info on the USON component package.
USON Component Package
Synonyms, variants, dimensions, 3D models, land patterns and more info on the USON component package.
uSOP Component Package
uSOP Component Package
WLCSP Component Package
WLCSP Component Package
WOG Component Package
WOG Component Package
WSON Component Package
Synonyms, variants, dimensions, 3D models, land patterns and more info on the WSON component package.
WSON Component Package
Synonyms, variants, dimensions, 3D models, land patterns and more info on the WSON component package.
Component Size Reference Chart
The below image shows is a printable component package comparison chart. It shows a number of popular SMD (and a few through-hole) packages which are drawn to scale (when printed on A4 paper, it will print with a 1:1 scale). Hopefully this gives you a visual guide to the different sizes of various things you may be considering adding to your PCB.
It is also available as a printable PDF. If you print to A4 paper it will print with a 1:1 scale (make sure to deselect “fit to size”).
Break-out Boards
Break-out boards (a.k.a. IC adapters) are useful for converting one package footprint into another. They are particular common for converting smaller SMT package footprints into 100mil DIP packages for prototyping with modern ICs.
If not brought from the right place, these break-out boards can be very expensive!
SparkFun is the cheapest supplier of break-out boards that I’ve found. Element14 also sells them, but at a much higher price.
ARIES Correct-A-Chip Series
ARIES makes a nice range of not-to-expensive (for one-of prototyping use) breakout boards for a variety of SMD packages as part of their Correct-A-Chip product range. Three examples from this family are shown below.
Element14 stocks most of the range, which can be found at https://nz.element14.com/w/c/tools-production-supplies/prototyping-tools-breadboards/prototyping-ic-adapters?CMP=KNC-GOO-SHOPPING-2476033&product-range=correct-a-chip.
Leadframes
Leadframes are the metal structures that are use during the manufacturing of certain component packages (both through-hole and surface mount) to provide the electrical connection from the IC die to the outside world1. The pins (a.k.a. leads) form part of the leadframe.
Examples of component packages that use leadframes:
- DIP
- QFN
- QFP
Standards
The JEITA EIAJ ED-7500A standard (local copy) has dimensions for TC-1 thru TB30, SC-1 thru SC-88A.
External References
If there is one other site I would direct you to for PCB information, it would be Tom Hausherr’s blog on the Mentor Graphics website.
3D models (which can be imported into Altium as step files) can be downloaded from 3D Content Central (www.3dcontentcentral.com). It is a combination of content submitted from both users and suppliers, can contains many standard component packages in 3D.
SiliconFarEast “IC Package Types” (http://www.siliconfareast.com/ic-package-types.htm) - A short but tidy graphical table describing most footprints. Also has data on the body size, body thickness, and lead pitch for the most common variants of each package.
The SMT Code Book (http://www.marsport.org.uk/smd/mainframe.htm) - Handy database for working out what small SMT components are. Since there is usually not enough space to print the entire part number, most manufacturers print their own kind of code of small SMT components. This makes it really hard to determine what they are. To make matters worse, many manufacturers use the same code for different components, and sometimes the manufacturer releases two components with the same code! The trick is to be able to identify the package and the code, and together you can get a good idea of what the component is. The SMT Code Book lists over 3,500 SMT device codes in alphabetical order.
Answers.com’s Surface-mount Technology page. Broad spectrum of information regarding SMT components, the production methods and package sizes.
Suggested Pad Layouts For A Number Of Packages (Diodes INC) - Many recommended pad layouts/land patterns for common packages all in one PDF!
Quick-tecks SMT Package Dimensions PDF, which contains hundreds of dimensions for common SMD component packages. You can download it from here, or alternatively, use the local link [here](/docs/Quick-tecks SMT Package Dimensions.pdf).