|Name||Smart Power Module|
|Similar To||Mini-DIP SPM|
|Solderability||Easy to solder by hand, infrared or reflow techniques.|
Package proprietary to Fairchild Semiconductor, used for some of their motor driver IC’s. Similar to a through-hole version called the Mini-DIP SPM. The package is designed to have a large flat top surface for heat sinking.
Posted: April 7th, 2015 at 9:56 am