SOT-583 Component Package
Article by:Geoffrey Hunter
Date Published: | |
Last Modified: |
Overview
SOT-583 is an 8-lead SMD component package.
Synonyms
- FCSOT: Flipchip SOT, Texas Instruments
- SOT-583-8: Monolithic Power Systems
Dimensions
SOT-583 has a pitch of 0.5mm. The package is 2.1mm x 1.6mm (including pins). The dimensions are shown in the image below.
Recommended Footprint
Solderability
Hard but not impossible to solder by hand because of the small 0.5mm pitch. Reflow soldering is recommended.
Thermal Parameters
Junction-to-ambient thermal resistance | \( R_{θJA} \) | \( 110^\circ C \cdot W^{-1} \) |
Junction-to-case (top) thermal resistance | \( R_{θJC(top)} \) | \( 41.3^\circ C \cdot W^{-1} \) |
Junction-to-bottom (PCB) thermal resistance | \( R_{θJB} \) | \( 20^\circ C \cdot W^{-1} \) |
Junction-to-top characterization parameter | \( \Psi_{JT} \) | \( 0.8^\circ C \cdot W^{-1} \) |
Junction-to-bottom characterization parameter | \( \psi_{JB} \) | \( 20^\circ C \cdot W^{-1} \) |
All thermal parameters from https://www.ti.com/lit/ds/symlink/tps628501-q1.pdf.
References
Texas Instruments. TPS628512 - 2.7-V to 6-V, 2-A, fixed-frequency, step-down converter in SOT583 package. Retrieved 2024-04-19 from https://www.ti.com/product/TPS628512. ↩︎
Authors
This work is licensed under a Creative Commons Attribution 4.0 International License .
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