|Name||Land Grid Array|
|Pin Count||Approx 5-2000.|
|Solderability||Cannot solder with a soldering iron, soldering with hot air or infrared is o.k., recommended practise is to use reflow techniques.|
The LGA package comes in many different variants, all which have a different number of pins and a different pin configuration. The pins are normally lines up in a grid of x columns and y rows, but not every position may have a pad. Therefore you can get variants with the same LGA package width and length.
Like BGA’s, LGA packages can withstand up to 50% mis-alignment when soldering, as the package will automatically align itself. LGA packages can be connected to the PCB either with a socket or direct soldering. Intel has popularised the package by using it on some of it’s CPU families.
Default Gallery Type Template
This is the default gallery type template, located in:
If you're seeing this, it's because the gallery type you selected has not provided a template of it's own.