|Name||Land Grid Array|
|Pin Count||Approx 5-2000.|
|Solderability||Cannot solder with a soldering iron, soldering with hot air or infrared is o.k., recommended practise is to use reflow techniques.|
The LGA package comes in many different variants, all which have a different number of pins and a different pin configuration. The pins are normally lines up in a grid of x columns and y rows, but not every position may have a pad. Therefore you can get variants with the same LGA package width and length.
Like BGA’s, LGA packages can withstand up to 50% mis-alignment when soldering, as the package will automatically align itself. LGA packages can be connected to the PCB either with a socket or direct soldering. Intel has popularised the package by using it on some of it’s CPU families.
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Posted: April 5th, 2015 at 10:58 am