1-3G1G Component Package
Overview
Overview
Overview
Overview
Micro3 is the package code used by Infineon/International Rectifier for the SOT-23-3 package. See the SOT-23 Component Package page for more info.
MPAK is the package code used by NXP Semiconductors for the SOT-23-3 package. See the SOT-23 Component Package page for more info.
Overview
SC-59 is the JEITA EIAJ package code for the SOT-23-3 package. See the SOT-23 Component Package page for more info.
SC-74A is a JEITA designator for a variant of the SOT-23 package. See the SOT-23 Component Package page for more information.
Overview
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the SOT-23 component package.
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the SOT-23F component package.
SOT-457 is a JEDEC name for the SOT-23-6 package, a 6-pin variant of the popular SOT-23 package. See the SOT-23 Component Package page for more information.
SOT-753 is a synonym for the SOT-23-5 package, a variant of the popular SOT-23 package with 5 pins. See the SOT-23 Component Package page for more information.
Overview
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-236AA component package.
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-236AB component package.
Synonyms, variants, dimensions, 3D models, land patterns and more info on the WSON component package.