QFN Component Package
Dimensions, recommended footprints, thermal resistances, lead styles, singulation methods, synonyms and other info about the QFN component package.
Dimensions, recommended footprints, thermal resistances, lead styles, singulation methods, synonyms and other info about the QFN component package.
Overview
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the SOT-23 component package.
SOT-457 is a JEDEC name for the SOT-23-6 package, a 6-pin variant of the popular SOT-23 package. See the SOT-23 Component Package page for more information.
Dimensions, land patterns and more info for TO-220 package variants such as TO-220AB, TO-220AC and TO-220-7.
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-253AA component package.
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-253AA component package.
Dimensions, land patterns, thermal resistances and more info on the TO-273AA (Super TO-220) component package.