1-3G1G Component Package
Overview
Overview
Overview
Overview
Micro3 is the package code used by Infineon/International Rectifier for the SOT-23-3 package. See the SOT-23 Component Package page for more info.
MPAK is the package code used by NXP Semiconductors for the SOT-23-3 package. See the SOT-23 Component Package page for more info.
Overview
SC-59 is the JEITA EIAJ package code for the SOT-23-3 package. See the SOT-23 Component Package page for more info.
Overview
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the SOT-23 component package.
Overview
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-236AA component package.
Variants, pin counts, pitches, solderability, thermal resistances, dimensions, land patterns, 3D models and more info for the TO-236AB component package.