COMPONENT PACKAGES
UQFN Component Package
| Date Published: | |
| Last Modified: |
Overview
| Name | Ultra-thin Quad Flat Non-leaded |
| Synonyms | n/a |
| Variants | n/a |
| Similar To | |
| Mounting | SMD |
| Pin Count | 4 |
| Pitch | 5.08mm (200mill) |
| Solderability | Can be soldered with a soldering iron with moderate experience, as long as it doesn't have a centre pad. |
| Thermal Resistance | n/a |
| Land Area | n/a |
| Height | n/a |
| 3D Models | n/a |
| Common Uses | ICs |
Comments
An ultra-thin QFN package. Commonly used for packaging 4 or 5 TVS diodes together.
3D Renders
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