COMPONENT PACKAGES

SOT-1226 Component Package

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Overview

NameSmall Outline Transistor 1226 (SOT-1226)
3D Render
A 3D render of the SOD-1226 component package. Image from http://www.nxp.com/packages/sot1226.html.

A 3D render of the SOD-1226 component package. Image from http://www.nxp.com/packages/sot1226.html.

Synonyms* X2SON5 (NXP)
Variantsn/a
Similar Ton/a
MountingSMD
Pin Count8
Pitch0.5mm
SolderabilityCannot be soldered with a soldering iron. Requires reflow oven or infrared heater.
Thermal Resistancen/a
Dimensions0.80x0.80x0.35mm
3D Models 
PopularityLow (as of March 2015)
Common Uses
  • Logic gates
  • Line drivers

Comments

A unique feature of this package is the diamond-shaped pads.

As of March 2015, NXP seems to be the only manufacturer using this package. NXP has a series of logic gates and line drivers in this package.

Dimensions

The dimensions of the SOT-1226 component package. Image from http://www.nxp.com/documents/outline_drawing/sot1226_po.pdf.

The dimensions of the SOT-1226 component package. Image from http://www.nxp.com/documents/outline_drawing/sot1226_po.pdf.

The recommended footprint (land pattern) for the SOT-1226 component package.

The recommended footprint (land pattern) for the SOT-1226 component package.


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