COMPONENT PACKAGES

Mini-DIP SPM

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Overview

NameMini Dual In-Line Package
Synonyms
  • SPM27-JA
  • SPM27-CC
  • SPM27-EC
Variantsn/a
Similar ToDIP
MountingTH
Pin Count27
Pitch1.778mm, 2.050mm, 2.531mm (3 different pitches on the one package!)
SolderabilityEasy to solder by hand.
Thermal Resistancen/a
Land AreaMini-DIP SPM 27 : 44mm x 26.8mm = 1179.2mm^2
Height3.15mm (when mounted)
3D Modelsn/a
Common UsesBLDC motor drivers from Fairchild

Comments

The SPM27-JA does not have a top-side copper face, while the SPM27-CC and SPM27-EC do. The copper face has been designed specifically for heatsinking as these IC’s are designed to be able to handle plenty of power. This package is rather unique in the fact it contains a three-phase IGBT inverter circuit power block and four drive IC’s. As of 2012, only a 27-pin variant exists.

3D Renders

A 3D render of the Mini-DIP SPM component package.

A 3D render of the Mini-DIP SPM component package.


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