COMPONENT PACKAGES

D3PAK (TO-268) Component Package

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Date Published:	April 7, 2015
Last Modified:	April 7, 2015

Overview

Name	TO-263 (D3PAK)
Synonyms	TO-263 (Transistor Outline 268) D3PAK DDDPAK Decawatt Package 3 TO-268AA (TO-268-3)
Variants	n/a
Similar To	TO-263
Mounting	SMD
Pin Count	3
Pitch	5.461mm
Solderability	Easy to solder by hand, as long as you have a decent powered soldering iron for the central thermal pad. Easy to solder with infrared and reflow techniques.
Thermal Resistance	\(T_{JC}: 0.24-1.18^{\circ}{\rm C}/W\) \(T_{JA}: 40^{\circ}{\rm C}/W\) \(T_{JA}: 21.9^{\circ}{\rm C}/W\) (13.5x17.5mm copper pad) \(T_{JA}: 18^{\circ}{\rm C}/W\) (19x29.4mm copper pad)
Land Area	n/a
Height	5.03mm
Weight	6.2g
3D Models	[TO-268AA (D3PAK)](http://www.3dcontentcentral.com/secure/download-model.aspx?catalogid=171&id=399669)
Common Uses	Microsemi power MOSFETs Microsemi power diodes Microsemi power IGBTs

Comments

The TO-268 (D3PAK) package is bigger than the TO-263 (D2PAK) package. The D3PAK name stands for “decawatt 3 package”. Unlike the TO-263 package, the TO-268 package only comes in one variant with 3 pins.

It is designed to have a really low thermal resistance so that it can be used in high power applications. The larger die also means that MOSFETs in this package can have lower \(R_{DS(ON)}\) values, resulting in less power dissipation for the same current.

I have only ever seen this in the 3-pin variant (called TO-268-3).