COMPONENT PACKAGES

D3PAK (TO-268) Component Package

Date Published:
Last Modified:

Overview

NameTO-263 (D3PAK)
Synonyms
  • TO-263 (Transistor Outline 268)
  • D3PAK
  • DDDPAK
  • Decawatt Package 3
  • TO-268AA (TO-268-3)
Variantsn/a
Similar ToTO-263
MountingSMD
Pin Count3
Pitch5.461mm
SolderabilityEasy to solder by hand, as long as you have a decent powered soldering iron for the central thermal pad. Easy to solder with infrared and reflow techniques.
Thermal Resistance
  • \(T_{JC}: 0.24-1.18^{\circ}{\rm C}/W\)
  • \(T_{JA}: 40^{\circ}{\rm C}/W\)
  • \(T_{JA}: 21.9^{\circ}{\rm C}/W\) (13.5x17.5mm copper pad)
  • \(T_{JA}: 18^{\circ}{\rm C}/W\) (19x29.4mm copper pad)
Land Arean/a
Height5.03mm
Weight6.2g
3D Models[TO-268AA (D3PAK)](http://www.3dcontentcentral.com/secure/download-model.aspx?catalogid=171&id=399669)
Common Uses
  • Microsemi power MOSFET's
  • Microsemi power diodes
  • Microsemi power IGBT's

Comments

The TO-268 (D3PAK) package is bigger than the TO-263 (D2PAK) package. The D3PAK name stands for “decawatt 3 package”. Unlike the TO-263 package, the TO-268 package only comes in one variant with 3 pins.

It is designed to have a really low thermal resistance so that it can be used in high power applications. The larger die also means that MOSFETs in this package can have lower \(R_{DS(ON)}\) values, resulting in less power dissipation for the same current.

I have only ever seen this in the 3-pin variant (called TO-268-3).

Recommended land pattern for the D3PAK (TO-268) component package.

Recommended land pattern for the D3PAK (TO-268) component package.

Recommended stencil pattern for the D3PAK (TO-268) component package.

Recommended stencil pattern for the D3PAK (TO-268) component package.

Package Dimensions

Dimensions for the D3PAK (TO-268) component package.

Dimensions for the D3PAK (TO-268) component package.

Photos

Photo of the D3PAK (TO-268) component package.

Photo of the D3PAK (TO-268) component package.


Tags:

    comments powered by Disqus