|Name||Transistor Outline 263|
|Pin Count||3, 5, 7, or 9 (this is X1). All packages also have a thermal pad.|
|Solderability||Easy to solder by hand, as long as you have a decent powered soldering iron for the central thermal pad. Easy to solder with infrared and reflow techniques.|
The Standard Package (TO-263)
This package can be considered the SMT version of the TO-220AB. It is a 3, 5 or 7 leaded heavy-duty package that allows for good heat-sinking due to a large pad on it’s underside. Used frequently for high power MOSFETs, LDOs and SMPS. Comes with either a normal middle lead (X2 = nothing) or a short, cut-off middle lead (X2 = S).
The synonym for the TO-263 package, D2PAK, stands for “double decawatt package”. It was designed by Motorola for high power devices.
The junction-to-ambient thermal resistance for the TO-263 component package on both standard JEDEC 2-layer and 4-layer boards is shown below:
TO-263 THIN is a variant of the TO-263 component package by Texas Instruments. It shares a similar PCB footprint, but is significantly smaller in height (i.e. thinner).
It still has a similar exposed pad on it’s underside (making it footprint compatible with the standard TO-263 package).
The exact dimensions of the TO-263 THIN package are shown in the below image:
- TO-279 Component Package
- TO-263 Component Package
- March 2016 Updates
- TO-273AA Component Package
- SOT-665 Component Package