WSON Component Package

Overview

Name WSON (Small-outline No-lead Package)
Synonyms  
Variants Varying number of pins.
Similar To
  • SOIC
Mounting SMD
Pin Count 8 (all also have exposed thermal pad)
Pitch 1.27mm (just like SOIC), except for Texas Instrument’s WSON
Solderability Hard to solder with a soldering iron due to underside thermal pad.
Thermal Resistance  
Dimensions

WSON-8

  • Package: 6.0×5.0x0.80mm (w*l*h, Winbond package code ZP)
  • Recommended Land Pattern: 6.10×5.10mm (31.11mm2)
3D Models  
Common Uses
  • Flash memory ICs
  • Secondary-side bias regulators for DC-DC converters

Comments

The WSON package has a exposed thermal pad on the underside. However, it is not normally electrically connected to anything, and is optionally soldered to the PCB. It is recommended to be soldered when the PCB has a large amount of flex, else left unconnected.

Warning: Texas Instruments has a WSON package which does not have a pitch of 1.27mm! 

Below is an “odd shaped” SON package used by Numonyx flash chips that goes under the name VDFPN8. Notice the half-round appearance of the pins.

Outline and dimensions for the VDFPN8 (SON-8) component package of a Numonyx flash IC.Image from http://www.micron.com/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/Serial%20NOR/M25P/M25P128.pdf.
Outline and dimensions for the VDFPN8 (SON-8) component package of a Numonyx flash IC.Image from http://www.micron.com/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/Serial%20NOR/M25P/M25P128.pdf.

 

Posted: January 22nd, 2015 at 8:58 am
Last Updated on: October 26th, 2015 at 9:12 am